초록

A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

대표청구항 ▼

1. A semiconductor package comprising: a conductive clip having an interior surface;a dielectric body disposed over at least a portion of said conductive clip;at least one I/O terminal, a conductive pad, a track connecting said conductive pad to said I/O terminal, said dielectric body electrically i

1. A semiconductor package comprising: a conductive clip having an interior surface;a dielectric body disposed over at least a portion of said conductive clip;at least one I/O terminal, a conductive pad, a track connecting said conductive pad to said I/O terminal, said dielectric body electrically insulating said at least one I/O terminal from said conductive clip;a power semiconductor device having at least one power electrode electrically and mechanically connected to said conductive clip. 2. The semiconductor package of claim 1, wherein said power semiconductor device is a power MOSFET. 3. The semiconductor package of claim 1, wherein said power semiconductor device is an IGBT. 4. The semiconductor package of claim 1, wherein said conductive clip is can-shaped. 5. The semiconductor package of claim 1, wherein said conductive clip comprises copper. 6. The semiconductor package of claim 1, wherein said conductive clip is plated with either gold or silver. 7. The semiconductor package of claim 1, further comprising a solder resist body covering at least said track. 8. The semiconductor package of claim 1, wherein said dielectric body comprises a polymer.