Electronically scanned arrays and multi-chip modules (MCMs) that may be used in such arrays are provided. One MCM may include a set of one or more first semiconductor components and a plurality of second semiconductor components. The first semiconductor component set is coupled to the plurality of s
Electronically scanned arrays and multi-chip modules (MCMs) that may be used in such arrays are provided. One MCM may include a set of one or more first semiconductor components and a plurality of second semiconductor components. The first semiconductor component set is coupled to the plurality of second semiconductor components, and the first semiconductor component set is configured to control the plurality of second semiconductor components. Each of the plurality of second semiconductor components is accessible through a plurality of data strings providing communication between the first semiconductor component set and the plurality of second semiconductor components, each data string defining a unique path between the first semiconductor component set and the plurality of second semiconductor components, such that the plurality of data strings provide redundant data paths between the first semiconductor component set and the plurality of second semiconductor components.
대표청구항▼
1. A multi-chip module (MCM), comprising: a first semiconductor component;a plurality of second semiconductor components, wherein the first semiconductor component is coupled to the plurality of second semiconductor components, and wherein the first semiconductor component is configured to control t
1. A multi-chip module (MCM), comprising: a first semiconductor component;a plurality of second semiconductor components, wherein the first semiconductor component is coupled to the plurality of second semiconductor components, and wherein the first semiconductor component is configured to control the plurality of second semiconductor components;wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths providing communication defined by a plurality of data strings between the first semiconductor component and the plurality of second semiconductor components, each data string defining a unique path for the communication between the first semiconductor component and a unique subset of the plurality of second semiconductor components, such that the plurality of data strings define redundant data paths between the first semiconductor component and each of the plurality of second semiconductor components. 2. The multi-chip module of claim 1, wherein at least one of the first semiconductor component and the plurality of second semiconductor components comprise monolithic microwave integrated circuits (MMICs). 3. The multi-chip module of claim 1, wherein the first semiconductor component comprises at least one of silicon germanium (SiGe), gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP). 4. The multi-chip module of claim 1, wherein the first semiconductor component comprises an α-channel transmit/receive radio frequency integrated circuit (RFIC), where α is an integer. 5. A multi-chip module (MCM), comprising: a first set of one or more first semiconductor components;a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components;wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components for the communication, such that the plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, wherein the first set comprises an α-channel transmit/receive radio frequency integrated circuit (RFIC), where α is an integer, wherein the plurality of second semiconductor components comprise: β γ-channel second semiconductor components, where β×γ=α, and α, β, and γ are integers. 6. The multi-chip module of claim 1, wherein each of the plurality of second semiconductor components comprises at least one of a power amplifier, a low noise amplifier, and a transmit/receive (T/R) RFIC. 7. The multi-chip module of claim 1, wherein at least one of the first semiconductor component and the second semiconductor components comprise a T/R RFIC, the T/R RFIC comprising at least one of a T/R switch, a direction coupler, a PIN diode limiter, a power amplifier, and a low noise amplifier. 8. The multi-chip module of claim 1, wherein the plurality of second semiconductor components comprise at least one of silicon germanium (SiGe), gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP). 9. The multi-chip module of claim 1, wherein each of the plurality of second semiconductor components are accessible through at least three data strings. 10. The multi-chip module of claim 1, wherein each of the plurality of second semiconductor components is a first device in only one data string of the plurality of data strings. 11. A multi-chip module (MCM), comprising: a first set of one or more first semiconductor components;a plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components;wherein each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components for the communication, such that the plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, wherein the MCM is one of a plurality of MCMs in an electronically scanned array. 12. The multi-chip module of claim 1, further comprising a thermal management layer configured to remove heat from one or more of the first semiconductor component and the plurality of second semiconductor components, wherein the thermal management layer comprises at least one of an active thermal management component and a passive thermal management component. 13. The multi-chip module of claim 1, wherein the first set of semiconductor component comprises a distributed computing component, wherein the distributed computing component is configured to communicate with a master controller, and wherein the master controller is configured to distribute one or more tasks across a plurality of multi-chip modules with which the master controller is connected. 14. The multi-chip module of claim 1, further comprising an on-chip power supply configured to supply power to the first semiconductor component and the plurality of second semiconductor components. 15. A subassembly for an electronically scanned array, comprising: an antenna aperture layer configured to selectively emit and receive radio waves;a radio frequency (RF) ground layer;a radio frequency integrated circuit (RFIC) multi-chip module (MCM) attach layer, wherein the RFIC MCM attach layer has attached thereto a plurality of MCMs, each MCM comprising a first set of one or more first semiconductor components and a plurality of second semiconductor components controlled by the first set; anda thermal layer configured to draw heat away from at least one of the first set and the second semiconductor components, wherein the each of the plurality of second semiconductor components is accessible through a plurality of data paths defined by a plurality of data strings providing communication between the first set and the plurality of second semiconductor components, each data string defining a unique path between the first set and at least one of the plurality of second semiconductor components. 16. The subassembly of claim 15, wherein the thermal layer comprises at least one of: a thermal spreader, micro fluidic cooling, liquid metal cooling, a two-phased closed loop, and a refrigerant. 17. The subassembly of claim 15, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components. 18. The subassembly of claim 17, wherein each unique data path comprises a unique subset of the second semiconductor components. 19. The subassembly of claim 15, wherein at least one of the first set and the plurality of second semiconductor components comprise a monolithic microwave integrated circuit (MMIC). 20. The subassembly of claim 15, wherein the first set and the plurality of second semiconductor components comprise at least one of silicon germanium (SiGe), gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP). 21. The subassembly of claim 15, wherein the MCMs comprise one or more of processing components and data storage components, wherein the processing components and the data storage components are utilized by a master controller of the electronically scanned array to perform tasks of the electronically scanned array and are distributed across the plurality of MCMs. 22. The subassembly of claim 15, further comprising a plurality of data strings connecting each of the plurality of MCMs to a master controller of the electronically scanned array, such that the plurality of data strings provide redundant data paths between the master controller and the plurality of MCMs. 23. An electronically scanned array, comprising: a master controller; anda plurality of multi-chip transmit/receive modules, each transmit/receive module comprising:a first set of one or more first semiconductor components; anda plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components;wherein the each of the plurality of second semiconductor components is accessible through a first plurality of data paths providing communication between the first set and the plurality of second semiconductor components defined by a plurality of data strings, each data string of the first plurality of data strings defining a unique path between the first set and at least one of the plurality of second semiconductor components, such that the first plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, andwherein each of the transmit/receive modules is accessible by the master controller through a second plurality of data paths defined by a plurality of second data strings providing communication between the master controller and the plurality of transmit/receive modules, each data string of the second plurality of data strings defining a unique path between the master controller and at least one of the plurality of transmit/receive modules, such that the second plurality of data strings provide redundant data paths between the master controller and each of the plurality of transmit/receive modules, wherein the first set comprises an α-channel transmit/receive radio frequency integrated circuit (RFIC), and wherein the plurality of second semiconductor components comprise β γ-channel second semiconductor components, where β×γ=α, and α,β, and γ are integers. 24. The electronically scanned array of claim 23, wherein one or more of the first semiconductor components and the plurality of second semiconductor components comprise monolithic microwave integrated circuits (MMICs). 25. The electronically scanned array of claim 23, wherein the one or more of the first semiconductor components and the plurality of second semiconductor components comprise at least one of silicon germanium (SiGe), gallium arsenide (GaAs), gallium nitride (GaN), and indium phosphide (InP). 26. The electronically scanned array of claim 23, wherein each unique data path comprises a unique subset of the second semiconductor components. 27. The electronically scanned array of claim 23, wherein each of the plurality of second semiconductor components comprises at least one of a power amplifier, a low noise amplifier, and a transmit/receive (T/R) RFIC. 28. The electronically scanned array of claim 23, wherein at least one of the first semiconductor component and the second semiconductor component comprise a T/R RFIC, the T/R RFIC comprising at least one of a T/R switch, a directional coupler, a PIN diode limiter, a power amplifier, and a low noise amplifier. 29. The electronically scanned array of claim 23, wherein each of the plurality of second semiconductor components is accessible through at least three data strings. 30. An electronically scanned array, comprising: a master controller; anda plurality of multi-chip transmit/receive modules, each transmit/receive module comprising:a first set of one or more first semiconductor components; anda plurality of second semiconductor components, wherein the first set is coupled to the plurality of second semiconductor components, and wherein the first set is configured to control the plurality of second semiconductor components;wherein the each of the plurality of second semiconductor components is accessible through a first plurality of data paths defined by a plurality of data strings for communication between the first set and the plurality of second semiconductor components, each data string of the first plurality of data strings defining a unique path between the first set and at least one of the plurality of second semiconductor components, such that the first plurality of data strings define redundant data paths between the first set and each of the plurality of second semiconductor components, andwherein each of the transmit/receive modules is accessible by the master controller through a second plurality of data paths defined by a plurality of second data strings providing communication between the master controller and the plurality of transmit/receive modules, each data string of the second plurality of data strings defining a unique path between the master controller and the plurality of transmit/receive modules, such that the second plurality of data strings define redundant data paths between the master controller and the plurality of transmit/receive modules, wherein the first set comprises an α-channel transmit/receive radio frequency integrated circuit (RFIC), and wherein each of the plurality of second semiconductor components is a first device with respect to the first set in only one data path defined by the first plurality of data strings. 31. The electronically scanned array of claim 23, wherein the plurality of multi-chip transmit/receive modules comprise one or more of processing components and data storage components, wherein the processing components and the data storage components are utilized by a master controller to perform tasks of the electronically scanned array are distributed across the plurality of multi-chip transmit/receive modules. 32. The electronically scanned array of claim 23, wherein at least one of control elements and storage elements of a set of beam coefficients is distributed across two or more of the multi-chip transmit/receive modules.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (178)
Cornell, Bill G.; Szeto, Roland Y., 3-D weather buffer display system.
Frosch Robert A. Administrator of the National Aeronautics and Space Administration ; with respect to an invention of ( Pasadena CA) Gary Bruce L. (Pasadena CA), CAT Altitude avoidance system.
Brandao Ruy L. (02 Fort Lauderdale FL) Taylor ; Jr. Robert A. (02 Fort Lauderdale FL) The Bendix Corporation (02 Southfield MI), Data display system having a multilevel video storage device.
D\Addio Egidio (Naples ITX) Farina Alfonso (Rome ITX), Digital processor for radar signals which can perform adaptive suppression of clutter means of a parametric estimator.
Robinson, Paul Aaron; Bowles, Roland L., Estimation, transmission, receipt, and presentation of vehicle specific environmental conditions and hazards information.
Woodell, Daniel L.; Jinkins, Richard D.; Rademaker, Richard M., Less than full aperture high resolution phase process for terrain elevation estimation.
Kronfeld, Kevin M.; Lapis, Mary Beth; Walling, Karen L.; Chackalackal, Mathew S., Method and apparatus for identification of hazards along an intended travel route.
Conner Kevin J ; Kuntman Daryal ; Morici Martin M. ; Hammack Stephen D. ; Joyce Jim, Method and apparatus for implementing automatic tilt control of a radar antenna on an aircraft.
Daniel L. Woodell ; Roy E. Robertson ; Ying C. Lai, Method and system for detecting turbulence with reduced errors resulting from vertical shear components.
Jordan James R. (1842 Joliet Way Boulder CO 80303) Chadwick Russell B. (4371 N. 63rd St. Boulder CO 80301), Process for generating wind profiler data free of fixed ground clutter contamination.
Baron, Sr., Robert O.; Wilson, Gregory S.; Phillips, Ronald J.; Thompson, Tom S.; Davis, Brian Patrick, Real-time three-dimensional weather data processing method and system.
Churnside James H. (Boulder CO) Clifford Steven F. (Boulder CO) Hanson Steen G. (Fakse DKX), Single-ended dual spatial filter detector for the passive measurement of winds and turbulence aloft.
Woodell, Daniel L.; Jinkins, Richard D.; Meyer, Nathanael A.; Rademaker, Richard M.; Dickerson, Charles J., System and method for a terrain database and/or position validation.
Woodell, Daniel L.; Robertson, Roy E.; Meyer, Nathanael A.; Koenigs, Gregory J.; Sishtla, Venkata A., System and method for using a radar to estimate and compensate for atmospheric refraction.
Gordon Andrew A. (5193 Woodley Ave. Encino CA 91436), System for detecting and viewing aircraft-hazardous incidents that may be encountered by aircraft landing or taking-off.
Masuda Yoshihisa (Musashino JPX) Inuki Hisao (Higashi-Murayama JPX) Takahashi Kozo (Higashi-Kurume JPX), System for measuring height distributions of atmospheric temperature, wind direction and wind speed.
Rose, Jr.,Bruce L.; Miller,Ian James; Neilley,Peter Paul; Lidrbauch,James J.; Faciane,David Richard; Kleist,Michael R., System for producing high-resolution, real-time synthetic meteorological conditions for a specified location.
Rose, Jr.,Bruce L.; Miller,Ian James; Neilley,Peter Paul; Lidrbauch,James J.; Faciane,David Richard; Kleist,Michael R., System for producing high-resolution, real-time synthetic meteorological conditions for a specified location.
Woodell, Daniel L.; Jinkins, Richard D.; Meyer, Nathanael A.; Rademaker, Richard M.; Dickerson, Charles J., Terrain avoidance system and method using weather radar for terrain database generation.
Woodell,Daniel L.; Robertson,Roy E.; Dickerson,Charles J., Variable loop gain and resolution pulse system and method with point target editing capability.
Paul Aaron Robinson ; Roland L. Bowles, Vehicle specific hazard estimation, presentation, and route planning based on meteorological and other environmental data.
Seitz Thomas E. (Cedar Rapids IA) Pensis John G. (Marion IA) Woodell Daniel L. (Marion IA), Weather radar system with improved display characteristics.
Mathews Bruce D. (Catonsville MD) Mountcastle Paul D. (Columbia MD) Patterson Walter W. (Edgewater MD), Windshear radar system with upper and lower elevation radar scans.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.