According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate has first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric sub
According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and first and second electrode layers. The ceramic dielectric substrate has first and second major surfaces. The first and second electrode layers are provided inside the ceramic dielectric substrate. The second electrode layer is provided between the first electrode layer and the first major surface. The first electrode layer has a first surface at the first major surface side and a second surface at a side opposite to the first surface. The first electrode layer includes a first portion including the first surface. The first electrode layer includes a ceramic component and a metal component. A concentration of the ceramic component in the first portion is higher than an average concentration of the ceramic component in the first electrode layer.
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1. An electrostatic chuck, comprising: a ceramic dielectric substrate having a first major surface and a second major surface, the first major surface being where an object to be chucked is placed, the second major surface being at a side opposite to the first major surface;a base plate supporting t
1. An electrostatic chuck, comprising: a ceramic dielectric substrate having a first major surface and a second major surface, the first major surface being where an object to be chucked is placed, the second major surface being at a side opposite to the first major surface;a base plate supporting the ceramic dielectric substrate;at least one first electrode layer provided inside the ceramic dielectric substrate and connected to a high frequency power supply; andat least one second electrode layer provided inside the ceramic dielectric substrate and connected to a chucking power supply,the first electrode layer being provided between the first major surface and the second major surface in a Z-axis direction, the Z-axis direction being from the base plate toward the ceramic dielectric substrate,a dimension in the Z-axis direction of the first electrode layer being larger than a dimension in the Z-axis direction of the second electrode layer,the second electrode layer being provided between the first electrode layer and the first major surface in the Z-axis direction,the first electrode layer having a first surface and a second surface and being supplied with the high frequency power supply at the second surface side, the first surface being at the first major surface side, the second surface being at a side opposite to the first surface,the first electrode layer including a first portion and including a ceramic component and a metal component, the first portion including the first surface,a concentration of the ceramic component in the first portion being higher than an average concentration of the ceramic component in the first electrode layer. 2. The chuck according to claim 1, wherein the concentration of the ceramic component in the first portion is higher than a concentration of the ceramic component in a portion of the first electrode layer other than the first portion. 3. The chuck according to claim 1, wherein the first electrode layer further includes a second portion adjacent to the first portion in the Z-axis direction, andthe concentration of the ceramic component in the first portion is higher than a concentration of the ceramic component in the second portion. 4. The chuck according to claim 1, wherein the first electrode layer further includes a third portion including the second surface, anda concentration of the metal component in the third portion is higher than an average concentration of the metal component in the first electrode layer. 5. The chuck according to claim 4, wherein a thermal conductivity of the metal component is larger than a thermal conductivity of the ceramic component. 6. The chuck according to claim 1, wherein the first electrode layer further includes a third portion including the second surface, anda concentration of the metal component in the third portion is higher than a concentration of the metal component in a portion of the first electrode layer other than the third portion. 7. The chuck according to claim 1, wherein the first electrode layer further includes a third portion and a fourth portion, the third portion including the second surface, the fourth portion being adjacent to the third portion in the Z-axis direction, anda concentration of the metal component in the third portion is higher than a concentration of the metal component in the fourth portion. 8. The chuck according to claim 1, wherein a concentration of the metal component in the first portion is 30% or more. 9. The chuck according to claim 1, wherein the ceramic component is the same as a major component of the ceramic dielectric substrate. 10. The chuck according to claim 1, wherein the ceramic component includes at least one of aluminum oxide, aluminum nitride, silicon carbide, silicon nitride, or yttrium oxide. 11. The chuck according to claim 1, wherein the metal component includes at least one of palladium, silver, platinum, molybdenum, or tungsten. 12. The chuck according to claim 1, wherein a thickness of the first electrode layer is not less than 1 μm and not more than 500 μm. 13. The chuck according to claim 1, wherein the first electrode layer further includes a third portion including the second surface, anda concentration of the metal component in the third portion is higher than an average concentration of the metal component in the second electrode layer.
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