Apparatus and methods for chemical mechanical polishing
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B24B-037/013
H01L-021/00
H01L-021/66
H01L-021/321
H01L-021/3105
출원번호
16521366
(2019-07-24)
등록번호
10875143
(2020-12-29)
발명자
/ 주소
Hwang, James Jeng-Jyi
Wu, Jiann Lih
Peng, He Hui
Yang, Chi-Ming
출원인 / 주소
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
대리인 / 주소
WPAT, P.C., Intellectual Property Attorneys
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초록▼
An apparatus for CMP includes a platen, a wafer carrier retaining a semiconductor wafer during a polishing operation, a dresser configured to recondition a polishing pad disposed on the platen during the polishing operation, and a vibration-monitoring system configured to detect vibrations during th
An apparatus for CMP includes a platen, a wafer carrier retaining a semiconductor wafer during a polishing operation, a dresser configured to recondition a polishing pad disposed on the platen during the polishing operation, and a vibration-monitoring system configured to detect vibrations during the polishing operation. The vibration-monitoring system includes a first vibration sensor configured to generate a plurality of first vibration signals. An end point is triggered to the polishing when a change between the plurality of vibration signals reaches a value.
대표청구항▼
1. An apparatus for chemical mechanical polishing (CMP) comprising: a platen;a wafer carrier retaining a semiconductor wafer during a polishing operation;a dresser head retaining a disc configured to recondition a polishing pad disposed on the platen during the polishing operation; anda vibration-mo
1. An apparatus for chemical mechanical polishing (CMP) comprising: a platen;a wafer carrier retaining a semiconductor wafer during a polishing operation;a dresser head retaining a disc configured to recondition a polishing pad disposed on the platen during the polishing operation; anda vibration-monitoring system configured to detect vibrations during the polishing operation, wherein the vibration-monitoring system comprises: a first vibration sensor installed on the wafer carrier, and configured to detect vibrations of the wafer carrier to generate a plurality of first vibration signals related to the wafer carrier;a second vibration sensor installed on the dresser head, and configured to detect vibrations of the dresser head to generate a plurality of second vibration signals related to the dresser head; anda signal analyzer configured to filter noise from the dresser head according to the plurality of second vibration signals and construct a process pattern according to the plurality of first vibration signals. 2. The apparatus of claim 1, further comprising a slurry dispenser configured to dispense an abrasive slurry onto the polishing pad. 3. The apparatus of claim 2, further comprising a control system configured to control the platen, the wafer carrier, the dresser head and the slurry dispenser. 4. The apparatus of claim 1, wherein the vibration-monitoring system comprises a third vibration sensor installed on the platen and configured to detect vibration of the platen and to generate a plurality of third vibration signals. 5. The apparatus of claim 4, wherein the signal analyzer is configured to construct the process pattern according to the first vibration signals, the second vibration signals and the third vibration signals. 6. The apparatus of claim 5, wherein the signal analyzer filters noise from the platen according to the plurality of third vibration signals to construct the process pattern. 7. The apparatus of claim 4, wherein the signal analyzer builds a process pattern database according to the first vibration signals, the second vibration signals and the third vibration signals. 8. The apparatus of claim 7, wherein the signal analyzer filters noise from the platen according to the plurality of third vibration signals to construct the process pattern database. 9. A method for CMP, comprising: providing an apparatus comprising at least a platen, a wafer carrier, a dresser and a vibration-monitoring system;receiving a semiconductor wafer in the wafer carrier;polishing a surface of the semiconductor wafer and detecting vibrations of the platen, the wafer carrier and the dresser by the vibration-monitoring system;generating a plurality of vibration signals related to the vibrations of the wafer carrier, the dresser and the platen in the vibration-monitoring system, wherein the plurality of vibration signals includes a plurality of first vibration signals related to the wafer carrier, a plurality of second vibration signals related to the dresser and a plurality of third vibration signals related to the platen; filtering noise from the dresser and the platen according to the plurality of second vibration signals and the plurality of third vibration signals; andtriggering an end point to the polishing when a change between the plurality of first vibration signals reaches a value. 10. The method of claim 9, wherein the value is between approximately 20% and approximately 50%. 11. The method of claim 9, wherein the dresser comprises a dresser arm, a dresser head and a conditioning disc, and the plurality of second vibration signals are related to vibration of the dresser head. 12. The method of claim 9, further comprising constructing a process pattern according to the plurality of vibration signals and storing the process pattern to build a process pattern database in the vibration-monitoring system. 13. The method of claim 12, further comprising generating a standard process pattern from the process pattern database. 14. The method of claim 12, wherein the process pattern is a wafer carrier vibration pattern. 15. A method for CMP, comprising: providing an apparatus comprising at least a platen, a wafer carrier, a dresser and a vibration-monitoring system;receiving a semiconductor wafer in the wafer carrier;polishing a surface of the semiconductor wafer and detecting vibrations of the platen, the wafer carrier and the dresser by the vibration-monitoring system;generating a plurality of vibration signals related to the vibrations of the platen, the wafer carrier and the dresser, wherein the plurality of vibration signals includes a plurality of first vibration signals related to the wafer carrier, a plurality of second vibration signals related to the dresser and a plurality of third vibration signals related to the platen;filtering noise from the platen according to the plurality of second vibration signals and the dresser according to the plurality of third vibration signals;recognizing a standard process pattern from a process pattern database in the vibration-monitoring system;constructing a real-time process pattern according to the plurality of first vibration signals; andcomparing the real-time process pattern to the standard process pattern. 16. The method of claim 15, wherein the real-time process pattern comprises a wafer carrier vibration pattern. 17. The method of claim 15, further comprising raising an alarm when the real-time process pattern and the standard process pattern are mismatched. 18. The method of claim 15, wherein the dresser comprises a dresser arm, a dresser head and a conditioning disc, and the plurality of second vibration signals are related to vibration of the dresser head. 19. The method of claim 15, wherein the constructing of the real-time process pattern and the comparing of the real-time process pattern to the standard process pattern are simultaneously performed. 20. The method of claim 19, further comprising triggering an end point when the real-time process pattern and the standard process pattern are mismatched.
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