Abstract ▼

1. 1st year: A transmission electron microscopy is a very powerful analysis equipment in the analysis of microstructure of materials. Because transmission of electron is too hard due to dispersion of electron, a TEM specimen must be thin for electron to transmit it. Therefore, in this research, we d

1. 1st year: A transmission electron microscopy is a very powerful analysis equipment in the analysis of microstructure of materials. Because transmission of electron is too hard due to dispersion of electron, a TEM specimen must be thin for electron to transmit it. Therefore, in this research, we develop the technique of TEM specimen preparation like the following.

a. Development of technique preparing cross-section TEM specimen of $WSi_2/Si$, of which TEM specimen preparation is very difficult due to large difference of milling rate.

(1) We develope the technique of TEM specimen preparation of multi-layered semiconducting materials containing Pt,$WSi_2$, etc. on Si substrate, of which milling is very hard as compared with Si substrate so a specimen preparation is very difficult.

(2) We develope the technique of TEM specimen preparation of multi-layered semiconducting materials containing GaN etc. GaN is very fragile and its milling rate is very different as compared with sapphire substrate so a specimen preparation is very difficult, however GaN is widely studied as optical device.

b. Improvement and optimization of conventional TEM specimen preparing technique of multi-layered materials.

c. Development of new TEM specimen preparation technique using only mechanical polishing

d. Confirmation of whether it is achieved or not that a difference of thickness is below 20%. In this case we assume that a thickness of substrate is 10 nm

e. TEM observation to verify that prepared specimen is very thin and has no defect and damage

2. 2nd year: Analysis technique of high-resolution TEM(HRTEM) is core of TEM analysis technique and from this technique we are able to analyze microstructure of materials containing interface, structure, and defect as atomic scale. In HRTEM analysis technique, to observe atomic arrangement of materials having small atomic distance, improvement of resolution of TEM is necessary. In this research, we establish the HRTEM analysis technique to observe atomic arrangement of materials having atomic distance of 0.17nm. To develope HRTEM imaging technique, we use following strategy and method

a. Using the existing transmission electron microscopy with the minimum of the additional investment, we develope the technique with which the atomic distance less than 0.21nm, the resolution of TEM, can be observed

b. The technique of specimen preparation that is the results in the first year is used in maximumc. The factors that obstruct the resolution of TEM is minimized

d. The TEM imaging technique that is optimum to the atomic distance to observe is developed

e. The adjustment of defocus is used in order to develope the optimum TEM imaging technique

f. We observe the high resolution transmission electron microscopy images of the materials which have the atomic distance(0.17nm) less than the resolution of TEM(0.21nm), and confirm whether we develope the technique

목차 Contents

• 제 1 장. 서론...32
• 제 2 장. 국내외 기술개발 현황...39
• 제 3 장. 연구개발 수행 내용 및 결과...45
• 1 절. 원자배열 관찰을 위한 고분해능 투과전자현미경 시편제작법 확립(이종 재료간 두께차 20% 이내)...45
• 1. 기계적 연마만을 위한 시편 제작 기술 개발...48
• 2. 특정 영역의 분석을 위한 기계 연마만을 이용한 시편 제작법 개발...80
• 3. 벽개를 이용한 시편 제작법 개발...89
• 4. 시편 회전 속도 조절을 통한 이온 연마법 최적화 기술 개발...104
• 5. 기계 연마/이온빔 연마 조합형 시편 제작법 개발...117
• 6. 분말 시편 제작법 개발...124
• 2 절. 원자간 거리 0.17nm 고분해능 투과 전자현미경 분석기술 확보 및 신소재 원자 배열 관찰...130
• 1. 관찰한 재료의 원자간 거리에 최적인 결상 조건 개발을 위한 이론적 배경...130
• 2. 연구결과...177
• 제 4 장. 연구개발 목표 달성도 및 대외 기여도...205
• 1 절. 연구개발 목표 달성도...205
• 1. 원자배열 관찰을 위한 고분해능 투과전자현미경 시편제작법 확립(이종 재료간 두께차 20% 이내)...205
• 2. 원자간 거리 0.17nm인 신소재 원자배열 관찰에 필요한 고분해능 분석기술 확보 및 원자배열 관찰...205
• 2 절. 대외기여도...206
• 1. 공공기능수행실적...206
• 2. 산ㆍ학ㆍ연 협력거점 활동현황...207
• 제 5 장. 연구개발 결과의 활용계획...209
• 1 절. 연구개발결과의 활용계획...209
• 1. 기술이전 및 성과 활용...209
• 2. 첨단 기술정보의 제공, 연구기기 공동활용...210
• 3. 해외 연구기관과의 협력...210
• 4. 단기 강좌를 통한 기술협의, 기술교류 등 실질적 자문활동...211
• 제 6 장. 참고문헌...213