초록 ▼

1. 365㎚ 자외선에 노광량 150mJ/㎠의 광반응성, 현상속도 0.61sec/㎛의 현상성을 가지며, 비저항 3.65×10^-5Ω․㎝, 선폭 19.89㎛ 및 542gf/㎝의 기판 접합력을 가지고 Edge Curl이 2㎛ 이하인 감광성 Ag Paste의 조성 개발
2. Paste 저장안정성 672hr 이상, 3.50%의 저항변화율 및 1.75%의 저항균일도를 가지는 감광성 Ag Paste 양산 기술 개발
3. 두께 8.14㎛, 4.2%의 두께균일도, 370*470㎜ 기판상 0.2% 프린팅 선폭 균일도 및

1. 365㎚ 자외선에 노광량 150mJ/㎠의 광반응성, 현상속도 0.61sec/㎛의 현상성을 가지며, 비저항 3.65×10^-5Ω․㎝, 선폭 19.89㎛ 및 542gf/㎝의 기판 접합력을 가지고 Edge Curl이 2㎛ 이하인 감광성 Ag Paste의 조성 개발
2. Paste 저장안정성 672hr 이상, 3.50%의 저항변화율 및 1.75%의 저항균일도를 가지는 감광성 Ag Paste 양산 기술 개발
3. 두께 8.14㎛, 4.2%의 두께균일도, 370*470㎜ 기판상 0.2% 프린팅 선폭 균일도 및 58.18㎛ 이하의 Align accuracy를 구현하는 프린팅 공정 최적화 기술 개발
4. 평균 패턴 선폭 19.89㎛, 1.4%의 선폭균일도 및 두께 8.21㎛, 3.8%의 두께균일도를 구현하는 패터닝 공정 최적화 기술 개발
5. 감광성 Ag Paste 소재를 적용한 TSP 소자의 신뢰성 개발 및 평가 실시 - 저항변화율 4.75%, 저항균일도 1.54%, 비저항 균일도 4.00% 신뢰성 확보
6. 상기 특성을 만족하는 감광성 Ag Paste 개발 완료, pilot scale 시제품 수요기업 품질승인 획득

Abstract ▼

Ⅱ. The Object and necessity of Development
The main object of this development project is commercialization of photosensitive metal paste and typical process for this paste realizing 20㎛ electrode line for 1mm size narrow bezel on touch panel displays.
It is necessary that all kinds of touch p

Ⅱ. The Object and necessity of Development
The main object of this development project is commercialization of photosensitive metal paste and typical process for this paste realizing 20㎛ electrode line for 1mm size narrow bezel on touch panel displays.
It is necessary that all kinds of touch panel display, in example, Tablet PC, Notebook PC, AIO PC must be slim, light and have high resolution, narrow bezel which is possible to realize through decreasing the pattern size of electrode from 60㎛ to 20㎛. There are several conventional method for making trace metal electrode of touch panel. One is direct printing method. Printing step is screen printing process on the substrate with heat curable Ag paste. The next step is simple heat curing controlled 120~150℃ temperature condition. But this method is not possible to realize 20㎛/20㎛ line size commercially. It can give wide pattern size over than 60㎛/60㎛. Other is thin film photolithography method. It is traditional, qualified method for making fine pattern in semiconductor process, touch panel process as well. But the process is complicated for touch panel process. Because the productivity and competitive cost is very important for TSP industry. It is better method to process direct patterning with photosensitive Ag paste itself. The process can be simplified through screen printing, UV cujring with mask, developing unexposed part.
Ⅲ. The quantitative specification and the details of Development
○ Development of photosensitive organic composition
- Developing the organic composition which can be cured with the exposure energy below than 160mJ/㎠@365㎚
- Designing and synthesizing of photosensitive binder polymer, optimizing the composition of organic components which can develop the unexposed part with the rate under 2sec/㎛
- Developing the formulation which may have low Edge Curl below than 2㎛ on electrode pattern
○ Optimization of Ag powder and paste composition
- Developing the paste composition which can be cured with the exposure energy below than 160mJ/㎠@365㎚, developed the unexposed part with the rate under 2sec/㎛
- Developing the paste composition which realize the line width under 20㎛
- Optimization of Ag powder and paste composition which can give excellent specific resistance value below than 5×10^-5Ω‧㎝
- Developing the paste composition which give the adhesive force against substrate over than 50gf/㎝
- Optimizing and adopting the Ag powder by testing the variation of average size, shape, specific surface area, manufacturer, model, typical character
- Optimizing the composition which can give the quantitative target properties by testing component species, mixing ratio, process properties, electrode properties at the same time
○ Development of mass production technology
- Developing the paste composition which can guarantee storage stability over than 100hr
- Developing the paste composition which can guarantee property stability, both the changing range and the non-uniformity of resistance value have to be under 5%
○ Optimization of Printing Process
- Improving morphology of pattern and coating layer by controlling the squeeze, screen mesh, etc.
- Optimizing the process conditions which can be uniform, repeatable, reproducible by controlling printing pressure, speed, clearance of screen print equipment
- Optimization of printing process condition which can realize 8㎛ thickness, thickness non-uniformity under 10% at 370*470㎜ glass substrate and Align accuracy under 100㎛
○ Optimization of Patterning process
- Optimizing the lithography conditions for getting target pattern size with good shape
- Optimizing the develop process which can develop the unexposed part with the rate under 2sec/㎛
- Optimizing the heat treatment process condition
- Optimization of Patterning process which can realize the fine pattern size under 20㎛, the non-uniformity of pattern under 10%, the thickness non-uniformity under 10% at 8㎛ thickness
- Manufacturing the proto type TSP panel with 1㎜ size Bezel
○ Development of the reliability test condition and evaluation for TSP electrode
- Isothermal and isohumidity, thermal cycle, salt spray
- Specification : the changing rate and the non-uniformity of resistance value have to be under 5%, the non-uniformity of specific resistance value has to be nuder 10% after reliability test
○ Development of the reliability test condition and evaluation for TSP
- Isothermal and isohumidity, thermal cycle, salt spray, high temperature and high humidity, rapidly thermal transition test, high temperature test, low temperature test
- Specification : the changing rate and the non-uniformity of resistance value have to be under 5%, the non-uniformity of specific resistance value has to be nuder 10% after reliability test
Ⅳ. The performance of development (Commercialization performance)
○ Achieving 100% quantitative paste characteristics, process characteristics, electrode characteristics and reliability characteristics of the photosensitive Ag paste
○ The product of this development project, photosensitive Ag paste is approved through the engineering qualification test at customer site, nepes display Co. Ltd.
○ Manufacturing Proto-type product, photosensitive Ag paste
Ⅴ. The future plan of the performance
○ Commercialization by qualification for mass production quality of proto-type photosensitive Ag paste
○ New application search : photovoltaic, RFID, electronic blackboard, DID application and DoT(display of things) industry