초록 ▼

▣ 산업구조재의 잠닉손상 정밀 진단을 위한 선형/비선형 하이브리드 초음파 기술 개발
◎ 선형/비선형 초음파를 이용한 잠닉손상 진단 기술 개발 (UNET)
◎ 비선형 초음파 영상화 기술 개발 (UNIS)
▣ 마이크로/나노 구조물의 잠닉손상 정밀 진단을 위한 초고분해능 음향현미경(GHz-AMS) 기술 개발
◎ 마이크로/나노 구조물의 잠닉손상을 위한 고분해능 음향현미경 개발
◎ 마이크로/나노 박막 구조물 특성해석을 위한 고분해능 음향현미경 진단·검사 기술 개발
▣ 구조용 복합재료 및 반도체 패키징 재료의

▣ 산업구조재의 잠닉손상 정밀 진단을 위한 선형/비선형 하이브리드 초음파 기술 개발
◎ 선형/비선형 초음파를 이용한 잠닉손상 진단 기술 개발 (UNET)
◎ 비선형 초음파 영상화 기술 개발 (UNIS)
▣ 마이크로/나노 구조물의 잠닉손상 정밀 진단을 위한 초고분해능 음향현미경(GHz-AMS) 기술 개발
◎ 마이크로/나노 구조물의 잠닉손상을 위한 고분해능 음향현미경 개발
◎ 마이크로/나노 박막 구조물 특성해석을 위한 고분해능 음향현미경 진단·검사 기술 개발
▣ 구조용 복합재료 및 반도체 패키징 재료의 잠닉손상 정밀진단을 위한
Photo-Mixing 기반의 고속 고분해능 THz 영상/분광 기술 개발
◎ 테라헤르츠 파를 이용한 복합재료/반도체의 잠닉손상 검출 기술 개발
◎ 테라헤르츠 포토믹싱 기술을 이용한 고속/고분해능 영상화 시스템 개발(THIS)
▣ 첨단부품소재의 잠닉손상 정밀 진단을 위한 디지털 광융합기술 개발
◎ 디지털 홀로그래피 기술을 이용한 광 응용 잠닉 손상 진단 기술 개발(DHIS)
◎ 디지털 레이저 상관 기술을 이용한 광 응용 잠닉 손상 진단 기술 개발(DLCS)

(출처 : 보고서 요약서 3p)

Abstract ▼

Ⅳ. Research development results
1. Development of the linear/nonlinear hybrid ultrasonic technique for precise detection of hidden damages in industrial structures
(1) Development of Linear/Nonlinear Hybrid Ultrasonic Technique for Diagnosis of Hidden Damage (UNET)
The hidden damage diagnos

Ⅳ. Research development results
1. Development of the linear/nonlinear hybrid ultrasonic technique for precise detection of hidden damages in industrial structures
(1) Development of Linear/Nonlinear Hybrid Ultrasonic Technique for Diagnosis of Hidden Damage (UNET)
The hidden damage diagnostic method possible to detect micro-structural defects such as degradation and fatigue of material was developed based on nonlinear ultrasonic technique. The relationship between ultrasonic nonlinearity parameter and hidden damages was investigated, and the measurement of ultrasonic nonlinearity parameter was quantified, and method of reconstruction of stress-strain curved and estimation of 0.01% offset yield strength were developed. The design of the proto-type equipment have been completed based on the developing the hardware and software using proposed technique in this project, and the standard of the nonlinear ultrasonic technique is established for the field-application.
(2) Development of nonlinear ultrasonic imaging technique (UNIS)
SAIAN which is algorithm of hybrid linear/nonlinear ultrasonic characteristics imaging processing based on SAFT to diagnose hidden damage was developed and its algorithm was improved through verification and development of processing technique in time domain. The imaging system to visualize the closed crack have been established based on the developed algorithm.

2. Development of the high-resolution acoustic microscope technique for precise diagnosis in micro/nano structures
(1) Development of a high-resolution acoustic microscope for hidden damage of micro/nano structures
(2) Development of high-resolution acoustic microscope diagnosis and inspection technology for characterization of micro/nano thin film structures

3. Development of photomixing-based THz image/spectroscopy technique for diagnosis of hidden damages in composites materials
(1) Development of hidden damage detection technology for composite materials/semiconductors using terahertz waves
Hidden damage diagnosis technology was developed that can detect micro defects such as delamination, cracking, and moisture absorption of composite and semiconductor materials using pulse and CW type terahertz waves. The interaction between the terahertz wave and the hidden damage was identified, and the technology to measure thickness and the process of measuring the diffusion coefficient of the material were established. Based on the technology development, patents have been registered in the United States, China, and Korea.
(2) Development of high-speed/high-resolution imaging system using terahertz photo mixing technology (THIS)
In order to apply the photo-mixing terahertz imaging technology to the in-line process, a high-speed/high-resolution THz imaging system (THIS) was developed by introducing a galvano scanning system, an aspherical tele-centric lens, and a diode laser. Based on this, the integrated system was developed to detect the hidden damage of composite materials and semiconductors at in-line process.

4. Development of digital optical convergence technique for precision diagnosis of hidden damages in advanced components and materials
(1) Development of optical diagnosis technique for hidden damage using digital holographic interferometry system (DHIS)
A technique which is able to diagnose the hidden damage, such as the external and internal damage by impact and the defect that can be produced during the product manufacturing process, existed on the reflective ortransparent object target using digital holography technique was developed.
Using Michelson and Machzender interferometer, the reflective and the transparent types of phase shifting digital holographic interferometer were configured and the DC term and the twin image that cause the measuring error during the experiment were removed for obtaining an image in high resolution.
When an objective lens is not applied, the maximum measurement area was 11×11 ㎟ and the vertical measurement resolution of 10 nm was achieved and the digital holographic interferometry system which can apply the magnification of objective lens of x10, x20, x40, x60, x100 was successfully configured.
Additionally, to improve the industrial accessibility of digital holography technique, a new phase shifting method, which PZT for phase shifting is removed, based on IIC method was developed and as a result, the environmental constraints of digital holographic interferometry system was resolved.

(2) Development of optical diagnosis technique for hidden damage using digital laser correlation system (DLCS)
Using digital laser correlation technology, which can quantify phase shifting based on the principle of light interference, the hidden damage existed in the advanced components and materials, which respond differently from undamaged part to the extenal force conditions such as heat and electricity, was measured.
Based on the verification of the performance of digital laser correlation technology by measuring various measurement objects such as PCB, composite materials, and solar cell, the foundation for industrial applicability in a way different from the existing non-destructive testing was prepared.


(출처 : SUMMARY 13p)

목차 Contents

• 표지 ... 1
• 제 출 문 ... 2
• 보고서 요약서 ... 3
• 요 약 문 ... 4
• SUMMARY ... 10
• CONTENTS ... 17
• 목차 ... 19
• 제1장 연구개발과제의 개요 ... 21
• 제2장 국내외 기술개발 현황 ... 24
• 제1절 세계적 수준 ... 24
• 제2절 국내수준 ... 26
• 제3절 국내외 연구현황 ... 29
• 제4절 연구개발대상 기술의 경제적․산업적 중요성 및 연구개발의 필요성 ... 31
• 제3장 연구개발수행 내용 및 결과 ... 36
• 제1절 1세부 과제 ... 36
• 제2절 2세부 과제 ... 61
• 제3절 3세부 과제 ... 89
• 제4절 4세부 과제 ... 113
• 제5절 공동 연구 활동 및 결과 ... 139
• 제6절 연구 개발 기술의 차별성 ... 149
• 제4장 목표달성도 및 관련분야에의 기여도 ... 153
• 제1절 연구개발 수행내용 및 목표 달성도 ... 153
• 1. 개발 기술 별 TRL 목표 ... 153
• 2. 단계별 연구개발 수행 내용 ... 158
• 3. 최종 목표 ... 173
• 4. 세부 성능 목표에 대한 달성도 ... 174
• 제2절 기술발전에의 기여도 ... 178
• 1. 1세부 과제 ... 178
• 2. 2세부 과제 ... 179
• 3. 3세부 과제 ... 180
• 4. 4세부 과제 ... 182
• 제5장 연구개발결과의 활용계획 ... 183
• 제1절 1세부 과제 ... 183
• 제2절 2세부 과제 ... 185
• 제3절 3세부 과제 ... 187
• 제4절 4세부 과제 ... 192
• 제6장 연구개발과정에서 수집한 해외과학기술정보 ... 194
• 제7장 연구장비의 구축 및 활용 결과 ... 197
• 제8장 참고문헌 ... 200
• 붙임 수정·보완사항 내역 ... 207
• 연구성과(연구사업지원시스템 입력성과) ... 210
• 끝페이지 ... 295