Electroplating is common method to form the copper thin film because it is simple, safe, cheap. Electroplating has a high productivity, low growth temperature. However you need to have continue interest, because the variation depend on organic additives composition is big. Generally, as a copper fil...
Electroplating is common method to form the copper thin film because it is simple, safe, cheap. Electroplating has a high productivity, low growth temperature. However you need to have continue interest, because the variation depend on organic additives composition is big. Generally, as a copper film-coated grow, the change in the composition of plating electrolyte and organic additives influences the deposition film characteristics. In other words, the physical characteristics will be changed due to changing the growth direction of the particles, the surface of roughness and the refinement of particles.
In this study, the constant-current method, currently used method for the actual copper foil manufacturing process in electric gilding, was performed electroplating and accelerator increases the diffusion length of the copper ion, it allows to increase the deposition density. The inhibitor inhibits the deposition by reducing current density and the diffusion of copper ions. As such we ananlyzed physical properties of the copper foil and physical properties of the copper foil added organic additives composition. The titanium substrates was used to grow a copper film that was used electroplating and we deposited to use bubbles which is assisting the flow of copper ions. We tested a change in the characteristics when forming a thin film by adding HEC, SPSC, Coll-A, Cl-, H2SO4 showed high tendency in preliminary test, individually or in combination respectively from 0ppm, up to 100ppm. To analyze the characteristics we uesd FE-SEM, the surface roughness meter, tensile strength machine and MINITAB.
As a result, the physical properties of the copper foil has been displayed desired properties to add various additives.
Electroplating is common method to form the copper thin film because it is simple, safe, cheap. Electroplating has a high productivity, low growth temperature. However you need to have continue interest, because the variation depend on organic additives composition is big. Generally, as a copper film-coated grow, the change in the composition of plating electrolyte and organic additives influences the deposition film characteristics. In other words, the physical characteristics will be changed due to changing the growth direction of the particles, the surface of roughness and the refinement of particles.
In this study, the constant-current method, currently used method for the actual copper foil manufacturing process in electric gilding, was performed electroplating and accelerator increases the diffusion length of the copper ion, it allows to increase the deposition density. The inhibitor inhibits the deposition by reducing current density and the diffusion of copper ions. As such we ananlyzed physical properties of the copper foil and physical properties of the copper foil added organic additives composition. The titanium substrates was used to grow a copper film that was used electroplating and we deposited to use bubbles which is assisting the flow of copper ions. We tested a change in the characteristics when forming a thin film by adding HEC, SPSC, Coll-A, Cl-, H2SO4 showed high tendency in preliminary test, individually or in combination respectively from 0ppm, up to 100ppm. To analyze the characteristics we uesd FE-SEM, the surface roughness meter, tensile strength machine and MINITAB.
As a result, the physical properties of the copper foil has been displayed desired properties to add various additives.
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