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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.19 no.2 = no.131, 2002년, pp.187 - 194
오한석 (연세대학교 세라믹공학과, 엠이엠씨 코리아(주)) , 박성은 (연세대학교 세라믹공학과) , 이홍림 (연세대학교 세라믹공학과)
For the fine grinding process development of semiconductor monocrystalline silicon, wheel rotational speed, chuck rotational speed, feed rate and hysteresis force were controlled. Magic mirror system was used for grinding wheel pattern analysis. Curvature of wheel pattern was measured by fitting equ...
G.R. Fisher, Semiconductor International, Vol. 9, pp. 97-102,1998
R.K. Goodall, Semiconductor Silicon/1998, The Electrochemical Society, Proceeding Vol. 98-1, pp. 1303-1324, 1998
T. Abe, Precision Engineering, Vol 13 (4), 251-255, 1991
R. Vandamme, Y. Xin, and Z.J. Pei, 'Method of processing semiconductor wafers,' US Patent 6114245, 2000
K. Subramanian and Y.R.Shanbhag, Handbook of industrial diamond and diamond films, pp. 1023-1041. 1998
Z.J. Pei, and A. Strasbaugh, 'Fine grinding of silicon,' International Joumal of Machine Tools and Manufacture, Vol. 41, pp. 659-672. 2001
H.S. Oh, J.R. Kim, T.H. Kim, J.J. Yu, H.L. Lee, J.H. Lee, and D. Rice, 'The characterization of process induced damage of silicon wafering process mechanical damge,' Defects in Silicon III, The Electrochemical Society, Proceeding Vol. 99-1, pp. 100-108, 1999
H.S. Oh, S.E. Park, S.M. Jeong, S.S. Kim and H.L. Lee, 'Process induced mechnical damage and fine grinding process parameters,' pp. 287-294, ISAAT 2001
K. Kugimiya, 'Characterization of microdeformation and crystal defects in silicon wafer surfaces,' J. Electrochem. Soc., Vol. 130, pp. 2123-2125, 1983
S. Hahn, K. Kugimiya, K. Vojtechovsky, M. Sifalda, M. Yamashita, PR. Blaustein and K. Takahashi, 'Characterization of mirror-polished Si wafers and advanced Si substrate structures using magic mirror method,' Semicon. Sci. Technol. Vol. 7, pp. A80-A85, 1992
K. Kygimiya, 'Makyoh topography : comparison with X-ray topography,' Semicon. Sci. Technol. Vol. 7, pp. A91-A94, 1992
S. Tokura, N. Fujino, M. Ninomiya and K. Masuda, 'Characterization of mirror-polished wafers by Makyo Method,' J. of Crystal Growth, Vol. 103, pp. 437-442, 1990
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