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NTIS 바로가기Transactions on electrical and electronic materials, v.7 no.4, 2006년, pp.157 - 162
Park, Sung-Min (School of Mechanical Engineering, Pusan National University) , Jeong, Suk-Hoon (School of Mechanical Engineering, Pusan National University) , Jeong, Moon-Ki (School of Mechanical Engineering, Pusan National University) , Park, Boum-Young (School of Mechanical Engineering, Pusan National University) , Jeong, Hae-Do (School of Mechanical Engineering, Pusan National University) , Kim, Hyoung-Jae (Department Research & Development, G&P Technology)
Chemical-mechanical polishing (CMP), one of the dominant technology for ULSI planarization, is used to flatten the micro electro-mechanical systems (MEMS) structures. The objective of this paper is to achieve good planarization of the deposited film and to improve deposition efficiency of subsequent...
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SKW Associates, Inc. Characterization Products of Chemical Mechanical Polishing, SKW Associates. Last Updated: February 28, 2000
F. Ayazi and K. Najafi, 'Design and fabrication of a high-performance polysilicon vibrating ring gyroscope', Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual International Workshop, p. 25, 1998
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