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NTIS 바로가기電子工學會論文誌. Journal of the Institute of Electronics Engineers of Korea. SD, 반도체, v.44 no.1 = no.355, 2007년, pp.22 - 27
손영수 (한국기계연구원 지능형정밀기계연구본부)
we have been studied on the realization of the boundary layer controlled ozone process and related facilities in order to apply for the photo-resist strip process in the semiconductor and flat panel display manufacturing. By means of developing the technology for the high concentration ozone product...
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S, Nelson, 'Ozonated Water for Wafer Cleaning and Potoresist Removal', Solid State Technology, July, 1999, pp.107-112
J. Cheng, D. Nemeth, 'The Study of Temperature Effect in Photoresist Stripping with DIO3 Process', Technical Report, Akrion, Allentown, PA, April 12, 1999
Bruno Langlais David A,'Ozone in water treatment; application and engineering', American Water Works Association Research Foundation, 1991
J. K. Tong, et al., in Cleaning Technology in Semiconductor Device Manufacturing, J.Ruzyllo and R.E. Novak, Editors, PV 92-12, p.18, The Electrochemical Society Proceedings Series, Pennington, NJ (1992)
J. Wei and S. Verhaverbeke, in Cleaning Technology in Semiconductor Device manufacturing V, The Electrochemical Society, Inc., Pennington, NJ, 1998, pp.496-504
S. De Gendt, J. Wauters adn M. Heyns, A novel photoresist and Post-Etch Residue Removal Process Using Ozonated Chemistry, Solid State Technology, December, 1998, pp.57-60
Toshikazu Abe, Senji Ojima, et al, 'Photoresist Stripping Using Alkaline Accelerator Containing Wet-Vapor', Solid State Phenomena Vols. 76-77, pp.231-234, 2001
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