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한국공작기계학회논문집 = Transactions of the Korean society of machine tool engineers, v.17 no.2, 2008년, pp.1 - 6
원종구 (인하대학교 기계공학과 대학원) , 이정택 (인하대학교 기계공학과 대학원) , 이은상 (인하대 기계공학과)
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In recent years, developments in the semiconductor and electronic industries have brought a rapid increase in the use of large size silicon wafer. For further improvement of the ultra precision surface and flatness of Si wafer necessary to high density ULSI, it is known that polishing is very import...
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Won, J. K., Lee, J. T., and Lee, E. S., "The study on the optimum Machining characteristic of 12 inch wafer polishing," Proceesdings of the KSME 2006 Spring Annual Meeting, p. 281
Hahn, P., 2001, "The 300 mm silicon wafer - a cost and technology challenge," Microelectronic Engineering, Vol. 56, pp. 3-13
Pei, Z. J., 2002, "A study on surface grinding of 300 mm silicon wafers," International Journal of Machine Tools & Manufacture, Vol. 42, pp. 385-393
Won, J. K., Lee, J. T., and Lee, E. S., 2006, "The study on the optimum Machining characteristic of 12 inch wafer polishing," Proceedings of the KSME 2006 Spring Annual Meeting, p. 282
Kwon, D. H., Kim, H. J., and Jeong, H. D., 2002, "A study on the decay of friction force during CMP," Journal of the Korean Society of Precision Engineering, pp. 972-975
Lee, J. H., Baek, S. Y., and Lee, E. S., 2007, "Selection of Optimum Conditions for Improving Surface Roughness of Ferrule in Centerless Grinding," Transaction of KSMTE, pp. 63-69
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