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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.16 no.2, 2009년, pp.1 - 9
김종웅 (성균관대학교 마이크로 전자 패키징 연구소) , 이영철 (성균관대학교 신소재공학과 대학원) , 노보인 (성균관대학교 신소재공학과) , 윤정원 (성균관대학교 마이크로 전자 패키징 연구소) , 정승부 (성균관대학교 마이크로 전자 및 반도체 패키징 기술개발 사업단)
Conductive adhesives have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-containing solders. Numerous studies have shown that the conductive adhesives have many advantages over conventional soldering such as environmental...
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J. H. Lau, Flip Chip Technologies (McGraw-Hill, Inc., New York, pp. 25-59 (1995).
J. H. Lau, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (McGraw-Hill, Inc., NewYork, pp. 1-17 (2000).
Jong-Woong Kim, Dae-Gon Kim, Won Sik Hong and Seung-Boo Jung, "Evaluation of Solder Joint Reliability in Flip-Chip Packages during Accelerated Testing", Journal of Electronic Materials, 34, 1550 (2005).
Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee and Seung-Boo Jung, "Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint", Journal of Alloys and Compounds, 48, 1864 (2008).
De-Shin Liu, Chia-Yuan Kuo, Chang-Lin Hsu, Geng-Shin Shen, Yu-Ren Chen and Kuo-Cheng Lo, "Failure mode analysis of lead-free solder joints under high speed impact testing", Materials Science and Engineering A, 494, 196 (2008).
Jung-Sub Lee, Kun-Mo Chu, Rainer Patzelt, Dionysios Manessis, Andreas Ostmann and Duk Young Jeon, "Effects of Co addition in eutectic Sn-3.5Ag solder on shear strength and microstructural development", Microelectronic Engineering, 85, 1577 (2008).
Yi-Shao Lai, Po-Chuan Yang and Chang-Lin Yeh, "Effects of different drop test conditions on board-level reliability of chip-scale packages", Microelectronics Reliability, 48, 274 (2008).
Yi Li, Myung Jin Yim, Kyoung Sik Moon and C.P. Wong, "Novel Nano-Scale Conductive Films With Enhanced Electrical Perfonnance and Reliability for High Perfonnance Fine Pitch Interconnect", IEEE Transactions on Advanced Packaging, 32, 123 (2009).
J. H. Constable, "Analysis of the Constriction Resistance in an ACF Bond", IEEE Transactions on Components and Packaging Technologies, 29, 494 (2006).
J. Liu, "Recent advances in conductive adhesives for direct chip attach applications", Proceedings ofthe First IEEE International Symposium on Polymeric Electronics Packaging, 107 (1997).
Jong-Woong Kim, Dae-Gon Kim, Young-Chul Lee and Seung-Boo Jung, "Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections", IEEE Transactions on Components and Packaging Technologies, 31, 65 (2008).
Myung-Jin Yim and Kyung-Wook Paik, "Design and linderstanding of Anisotropic Conductive Films (ACFs) for LCD Packaging", IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, 21, 226 (1998).
Jong-Woong Kim, Dae-Gon Kim, Ja-Myeong Koo, JeongWon Yoon, Sunglak Choi, Kyung-Sik Kim, Jae-Do Nam, Hoo-Jeong Lee, Jinho Joo and Seung-Boo Jung, "Characterization of Failure Behaviors in Anisotropic Conductive Interconnection", Materials Transactions, 48, 1070 (2007).
Ranjith Divigalpitiya, "Electrical Characteristics of Contacts Made With Anisotropic Conductive Adhesives: Current Density Distributions at the Contact", IEEE Transactions on Components and Packaging Technologies, 31, 216 (2008).
Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong and Seung-Boo Jung, "Reliability of Au bump flip chip packages with adhesive materials using four-point bending test", International Journal of Adhesion and Adhesives, 29, 650 (2009).
Hyoung-Joon Kim and Kyung-Wook Paik, "Adhesion and Reliability ofAnisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface Finish", Journal of Electronic Materials, 37, 1003 (2008).
Hsien-Chie Cheng, Wen-Hwa Chen, Chieh-Sheng Lin, YungYu Hsu and Ruoh-Huey liang, "On the Thermal-Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology", IEEE Transactions on Advanced Packaging, 32, 546 (2009).
Kyung-Woon Jang, Chang-Kyu Chung, Woong-Sun Lee and Kyung-Wook Paik, "Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications", Microelectronics Reliability, 48, 1052 (2008).
Jong-Woong Kim, Young-Chul Lee, Sang-Su Ha, Ja-Myeong Koo, Jae-Hoon Ko, Wansoo Nah and Seung-Boo Jung, "Electrical characterization of adhesive flip chip interconnects for microwave application", Journal of Micro/Nanolithography, MEMS, MOEMS, 72, 023007 (2008).
Myung Jin Yim, In Ho Jeong, Hyung-Kyu Choi, Jin-Sang Hwang, Jin-Yong Ahn, Woonseong Kwon and Kyung-Wook Paik, "Flip Chip Interconnection With Anisotropic Conductive Adhesives for RF and High-Frequency Applications", IEEE Transactions on Components and Packaging Technologies, 28, 789 (2005).
Jong-Woong Kim, Wansoo Nab and Seung-Boo Jung, "Transmission property of tlip chip package with adhesive interconnection for RF applications", Microelectronic Engineering, 86, 314 (2009).
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