최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.16 no.3, 2009년, pp.19 - 24
김용철 (KAIST 신소재공학과) , 이도선 (KAIST 신소재공학과) , 이원종 (KAIST 신소재공학과)
Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties o...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
L. Schaper, S. Burkett, M. Gordon, L. Cai, Y. Liu, G Jampana and I. U. Abhulimen, "Integrated System Development for 3-D VLSI",. 57th Electronic Components and Technology Development, 853(2007)
J. U. Knickerbocker, P. S. Andy, L. P. Buchwalter, A. Deut-sch, R. R. Horton, K. A. Jenkins, Y. H. Kwark, G McVicker, C. S. Patel, R. J. Polarstre, C. Schuster, A. Sharma, S. M. Sri-Jayantha, C. W. Surovic, C. K. Tsang, B. C. Webb, S. L. Wright, E. J. Sprogis and B. Dang, "Development of Next-generation System-on-package Technology Based on Silicon Carriers with Fine-pitch Chip Interconnection", IBM J. Res. Develop., 49(4,5) 725(2005)
L. Jiang, P. He, G. He, X. Zong and C. Lee, "Copper Thermal Diffusion in TaN Films on Si Substrate", Jpn. J. Appl. Phys., 41, 6525(2002)
D.W. Butler, C.T.H. Stoddart and P. R. Stuart, "The Stylus or Scratch Method for Thin Film Adhesion Measurement: Some Observations and Comments", J. Phys. D, 3, 877(1970)
M. Lane, R.H. Dauskardt, N. Krishna and I. Hashim, "Adhesion and Reliability of Copper Interconnects with Ta and TaN Barrier Layers", J. Mater. Res., 15(1), 203(2000)
K. H. Min, K. C. Chun and K. B. Kim, "Comparative Study of Tantalum and Tantalum nitrides ( $Ta_2N$ and TaN) as a Diffusion Barrier for Cu Metallization", J. Vac. Sci. Technol. B, 14(5), 3263(1996)
T. Oku, E. Kawakami, M. Uekubo, K. Takahiro, S. Yamagu-chi and M. Murakami, "Diffusion Barrier Property of TaN between Si and Cu", Appl. Surf. Sci., 99, 265(272)
※ AI-Helper는 부적절한 답변을 할 수 있습니다.