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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.17 no.3, 2010년, pp.71 - 77
박경진 (홍익대학교 신소재공학과) , 정명원 (홍익대학교 신소재공학과) , 이재호 (홍익대학교 신소재공학과)
Mg alloys have been used in automobile industry, aerospace, mobile phone and computer parts owing to low density. However, they have a restricted application because of low mechanical and poor corrosion properties. Thus, improved surface treatments are required to produce protective films. Environme...
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