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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.17 no.4, 2010년, pp.11 - 17
이기주 (오사카대학교 지능기능창성공학과) , 김근수 (오사카대학교 산업과학연구소) , 가차와키스가누마 (오사카대학교 산업과학연구소)
The electromigration phenomenon in lead-free flip-chip solder joint has been one of the serious problems. To understand the mechanism of this phenomenon, the crystallographic orientation of Sn grain in the Sn-Ag-Cu solder bump has been analyzed. Different time to failure and different microstructura...
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핵심어 | 질문 | 논문에서 추출한 답변 |
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EM은 어떻게 칩 내부에서 단선을 발생시키는가? | Fig. 1에 나타낸 것과 같이, 온도가 상승하여 열적으로 활성화된 배선부 혹은 솔더범프의 금속원자는 전자의 강한 흐름 (wind라고 표현한)이 발생하면 이것이 구동력이 되어 같은 방향으로 이동하게 된다 (검은 색의 원자가 electron wind에 의해 공공으로 확산). 그 결과 cathode측에서는 원자의 확산에 의해 격자에 공공이 발생하고, 이것이 집적된 보이드의 형성, 성장으로 인해 단선 고장에 이르게 되고, anode측에서는 금속간화합물이 크게 성장하게 된다. 실제 플립칩 패키지에서의 단선 고장은 EM 뿐만 아니라 열에 의한 확산, 온도구배에 의한 확산, 응력에 의한 확산이 복잡하게 작용하여 발생한다. | |
EM이 쉽게 발생하는 조건은 무엇인가? | Electro-migration (EM)은 반도체배선의 심각한 결함 중에 하나로 메카니즘의 해명, 대책에 관한 연구가 최근에도 보고되고 있다. 플립칩 접합부의 미세화가 진행되면서 배선에 흐르는 전류치도 크게 상승하여104 A/cm2 이상으로 전류밀도가 상승할 것으로 예상되고 있다. 이런 환경에서 반도체 내부배선의 발열에 의해 플립칩 접합부의 온도가 상승하면 EM이 쉽게 발생한다.1-6) EM은 electron wind에 기인하는 것으로 알려져 있다. | |
솔더 접합부의 EM에 의한 고장이 현실적인 문제로 인식된 이유는 무엇인가? | 차세대 패키징 기술을 실현하기 위해서는 극복해야 할 기술적인 과제들이 많이 존재한다. 그중에서 솔더 접합부의 EM에 의한 고장은 오랜전부터 알려진 과제이지만, 고밀도화, 파인핏치화, 발열문제가 심각해지면서 현실적인 문제로 인식되기 시작했다. 더욱이 솔더가 무연화 되면서 다양해진 구성원소들의 영향에 대한 연구가 시작되었다. |
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