[논문]Evaluation of Particle Removal Efficiency during Jet Spray and Megasonic Cleaning for Aluminum Coated Wafers

Choi, Hoomi; Min, Jaewon; Kulkarni, Atul; Ahn, Youngki; Kim, Taesung

[국내논문] Evaluation of Particle Removal Efficiency during Jet Spray and Megasonic Cleaning for Aluminum Coated Wafers 원문보기

반도체디스플레이기술학회지 = Journal of the semiconductor & display technology, v.11 no.3, 2012년, pp.7 - 11

Choi, Hoomi (SKKU Advanced Institute of Nanotechnology) , Min, Jaewon (Samsung Electronics) , Kulkarni, Atul (School of Mechanical Engineering) , Ahn, Youngki (School of Mechanical Engineering) , Kim, Taesung (SKKU Advanced Institute of Nanotechnology)

Abstract ▼ AI-Helper

Among various wet cleaning methods, megasonic and jet spray gained their popularity in single wafer cleaning process for the efficient removal of particulate contaminants from the wafer surface. In the present study, we evaluated these two cleaning methods for particle removal efficiency (PRE) and pattern damage on the aluminum layered wafer surface. Also the effect of $CO_2$ dissolved water in jet spray cleaning is assessed by measuring PRE. It is observed that the jet spray cleaning process is more effective in terms of PRE and pattern damage compared to megasonic cleaning and the mixing of $CO_2$ in the water during jet sprays further increases the PRE. We believe that the outcome of the present study is useful for the semiconductor cleaning process engineers and researchers.

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제안 방법

Particles contain several components such as Al, O, and Si with non-spherical shape. And to observe the morphology, initially we measured the overall distribution of contaminant particles by using AIT and then we checked each detected point by using SEM. Size of contaminant particles distributes 0.
In this study, we systemically evaluated megasonic and jet spray cleaning during semiconductor manufacturing process. We observed that jet spray cleaning is more effective than megasonic cleaning process for aluminum surface layer through PRE evaluation.

참고문헌 (12)

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