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NTIS 바로가기한국생산제조시스템학회지 = Journal of the Korean Society of Manufacturing Technology Engineers, v.22 no.1, 2013년, pp.168 - 172
Kim, Seong Keol (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Jang, Chong-Min (Graduate School of Mechanical Design & Automation Eng., Seoul National University of Science and Technology) , Hwang, Jung-Min (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology) , Park, Man-Chul (Department of Mechanical System Design Engineering, Seoul National University of Science and Technology)
In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D pack...
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Kim, Y., Kang, S. K., and Kim, S. E., 2010, "Study of Thinned Si Wafer Warpage in 3D Stacked Wafers," J. of Microelectron Reliab., Vol. 50, No. 12, pp. 1988-1993.
Maeng, K. H., Kim, Y. K., Kang, S. G., Kim, S. D., and Kim, S. E., 2011 "Stress Analysis of Stacked Si Wafer in 3D WLP," J. of Applied Physics, Vol. 11, No. 4, pp. s119-s123.
Kim, Y. K., Kang, S. K., Kim, S. D., and Kim, S. E., 2012, "Wafer warpage analysis of stacked wafers for 3D integration," Microelectron Eng., Vol. 89, pp. 46-49.
Ko, C. T., and Chen, K. N., 2010, "Wafer-level Bonding/ Stacking Technology for 3D Integration", J. of Microelectron Reliab., Vol. 50, No. 4, pp. 481-488.
List, R. S., Webb, C., and Kim, S. E., 2002, "3D Wafer Stacking Technology," Proc. of Advanced Metallization Conference, pp. 29-36.
Plieninger, R., Dittes, M., and Pressel, K., 2006, "Modern IC Packaging Trends and Their Reliability Implications," J. of Microelectron Reliab., Vol. 46, No. 9-11, pp. 1868-1873.
Song, C. G., and Choa, S. H., 2010, "Analysis of Warpage Characteristics Of Subminiature Package For Mobile Devices," Proceeding of KSPE Fall Conference, pp. 439-440.
Park, S. M., Lee, H. J., and Park, S. J., 2012, "Warpage Analysis of Large-area Fan-out Molding Process," Proceeding of KSMTE 2012 Spring Conference, pp. 108-108.
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