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Journal of power electronics, v.14 no.6, 2014년, pp.1345 - 1356
Ayadi, Moez (Dept. of Electrical Engineering, National School of Electronic and Communication, University of Sfax) , Bouguezzi, Sihem (Dept. of Electrical Engineering, National School of Engineers of Sfax) , Ghariani, Moez (Dept. of Electrical Engineering, National School of Electronic and Communication, University of Sfax) , Neji, Rafik (Dept. of Electrical Engineering, National School of Engineers of Sfax)
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The thermal behavior of power modules is an important criterion for the design of cooling systems and optimum thermal structure of these modules. An important consideration for high power and high frequency design is the spacing between semiconductor devices, substrate structure and influence of the...
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