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Forming Gas Post Metallization Annealing of Recessed AlGaN/GaN-on-Si MOSHFET 원문보기

Journal of semiconductor technology and science, v.15 no.1, 2015년, pp.16 - 21  

Lee, Jung-Yeon (School of Electrical and Electronic Engineering, Hongik University) ,  Park, Bong-Ryeol (School of Electrical and Electronic Engineering, Hongik University) ,  Lee, Jae-Gil (School of Electrical and Electronic Engineering, Hongik University) ,  Lim, Jongtae (School of Electrical and Electronic Engineering, Hongik University) ,  Cha, Ho-Young (School of Electrical and Electronic Engineering, Hongik University)

Abstract AI-Helper 아이콘AI-Helper

In this study, the effects of forming gas post metallization annealing (PMA) on recessed AlGaN/GaN-on-Si MOSHFET were investigated. The device employed an ICPCVD $SiO_2$ film as a gate oxide layer on which a Ni/Au gate was evaporated. The PMA process was carried out at $350^{\circ}C$...

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제안 방법

  • In order to investigate the interface quality, the capacitance-voltage (C-V) characteristics were measured before and after PMA. C-V measurements were carried out using a circular recessed C-V pattern with a diameter of 50 mm.
  • It was reported that the insulator itself and interface conditions between insulator and semiconductor surface could be improved by appropriate post-annealing processes [8-12]. In this study, we investigated the effects of forming gas post metallization annealing (PMA) on recessed AlGaN/GaN-on-Si MOSHFET with ICPCVD SiO2 gate oxide.

대상 데이터

  • It should be noted that negative shift in threshold voltage was observed after forming gas PMA. In order to take a closer look at threshold voltage shift and uniformity issues, about 30 devices were measured at various locations in the sample. The threshold voltage variations before and after PMA are compared in Fig.
  • The epitaxial layer structure consisted of a 4 nm undopped GaN capping layer, a 20 nm undoped AlGaN barrier, a 5 µm undoped GaN buffer on an N-type Si (111) substrate.

이론/모형

  • The ideal capacitance characteristics were obtained by Schroder’s method [19].
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참고문헌 (25)

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  6. E. Abdoulin et al, "High frequency 12V - 1V DCDC converters - Advantages of Using EPC's Galium Nitride (GaN) Power Transistors vs. Silicon-based Power MOSFETs," Application Note, Efficient Power Conversion Corporation, www.epcco.com, 2009. 

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  8. S. Chandra et al, "Effect of Annealing on Structural and Electrical Properties of Ge Metal-Oxide-Semiconductor Capacitors with Pt Gate Electrode and $HfO_2$ Gate Dielectric," Materials Tranasctions, Vol. 52, No. 1, pp.118-123, Dec., 2010. 

  9. H. Kambayashi et al, "High-quality $SiO_2$ /GaN Interface for Enhanced Operation Field-Effect Transistor," Physica Status Solidi A, Vol. 204, No. 6, pp.2032-2036, Jun., 2007. 

  10. R. D. Long et al, "Interface Trap Evaluation of Pd/ $Al_2O_3$ /GaN Metal Oxide Semiconductor Capacitors and The Influence of Near-Interface Hydrogen," Applied Physics Letters, Vol. 103, No. 20, p.201607, Nov., 2013. 

  11. Y. Lin et al, "AlGaN/GaN HEMTs With Low Leakage Current and High On/Off Ratio," IEEE Electron Device Letters, Vol. 31, No. 2, pp.102-104, Feb., 2010. 

  12. T. Hung et al, "Interface Charge Engineering for Enhancement-Mode GaN MISHEMTs," IEEE Electron Device Letters, Vol. 35, No. 3, pp.312-314, Mar., 2014. 

  13. B. R. Park et al, "High-Quality ICPCVD $SiO_2$ for Normally Off AlGaN/GaN-on-Si Recessed MOSHFETs," IEEE Electron Device Letters, Vol. 34, No. 3, pp. 354-356, Mar., 2013. 

  14. P. W. Peacock et al, "Behavior of Hydrogen In High Dielectric Constant Oxide Gate Insulators," Applied Physics Letters, Vol. 83, No. 10, pp. 2025-2027, Sep., 2003. 

  15. L. M. Terman et al, "An Investigation of Surface States at a Silicon/Silicon Oxide Interface Employing Metal-Oxide-Silicon Diodes," Solid-State Electronics, Vol. 5, No. 5, pp.285-299, Oct., 1962. 

  16. E. H. Nicollian et al, "The Si- $SiO_2$ Interface -Electrical Properties as Determined by the Metal- Insulator Silicon Conductance Technique," The Bell System Technical Journal, Vol. 46, No. 6, pp.1055-1133, Aug., 1967. 

  17. H.-P. Chen et al, "Re-examination of The Extraction of MOS Interface-State Density by C-V Stretchout and Conductance Methods," Semiconductor Science and Technology, Vol. 28, No. 8, p. 085008, Jun,. 2013. 

  18. A. J. Grede et al, "Components of Channel Capacitance in Metal-Insulator-Semiconductor Capacitors," Journal of Applied Physics, Vol. 114, No. 11, p. 114510, Sep., 2013. 

  19. D. K. Schroder, Semiconductor Material and Device Characterization, A John Wiley & Sons, Inc., Publication, 2006. 

  20. R. E.-H et al, "Comparison of Methods to Quantify Interface Trap Densities at Dielectric/III-V Semiconductor Interfaces," Journal of Applied Physics, Vol. 108, No. 12, p. 124101, Dec,. 2010. 

  21. D. Gregusova et al, "Trap States in AlGaN/GaN Metal-Oxide-Semiconductor Structures with $Al_2O_3$ Prepared by Atomic Layer Deposition," Journal of Applied Physics, Vol. 107, No. 10, p. 106104, May., 2010. 

  22. http://www.ioffe.rssi.ru/SVA/NSM/Semicond/GaN/bandstr.html 

  23. H. Kambayashi et al, "High Performance Normally-Off GaN MOSFETs on Si Substrates," 224th ECS Meeting, 27-1, p. 1911, Oct., 2013. 

  24. H.-S. Yun et al, "Fabrication and Properties GaN MIS Capacitors with a Remote-Plasma Atomic-Layer-Deposited $Al_2O_3$ Gate Dielectric," Journal of the Korean Physical Society, Vol. 54, No. 2, pp. 707-711, Feb., 2009. 

  25. Y. Yao et al, "Normally-off GaN Recessed-gate MOSFET Fabricated by Selective Area Growth Technique," Applied Physics Express, Vol. 7, No. 1, p. 016502, Dec., 2013. 

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