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2. D.-H. Kim, S. Yoo, C.-W. Lee and T. Y. Lee, "Temperature Measurement and Contact Resistance of Au Stud Bump Bonding and Ag Paste Bonding with Thermal Heater Device", J. Microelectron. Packag. Soc., 17(2), 55 (2010). 

3. G. Kim, K.-M. Jung, J.-T. Moon and J.-H. Lee, "Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-Coated Cu Flake Filler", J. Microelectron. Packag. Soc., 21(4), 51 (2014). 

4. H. J. Kang, T. Kim and M. Y. Jeong, "PLC Devices Fabricated on Flexible Plastic Substrate by Roll-to-Roll Imprint Lithography", J. Microelectron. Packag. Soc., 22(4), 25 (2015). 

5. S. H. Seo, J.-H. Lee, J.-Y. Song and W.-J. Lee, "Control of Position of Neutral Line in Flexible Microelectronic System Under Bending Stress", J. Microelectron. Packag. Soc., 23(2), 79 (2016). 

6. T.-I. Lee, C. Kim, M. S. Kim and T.-S. Kim, "Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates", J. Microelectron. Packag. Soc., 23(3), 63 (2016). 

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9. J. Zhao, D. M. Zhang and J. Zhao, "Fabrication of Cu-Ag Core-Shell Bimetallic Superfine Ppowders by Eco-friendly Reagents and Structures Characterization", J. Solid State Chem., 184(9), 2339 (2011). 

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10. D. S. Jung, H. M. Lee, Y. C. Kang and S. B. Park, "Air-stable Silver-coated Copper Particles of Sub-micrometer Size", J. Colloid Interface Sci., 364(2), 574 (2011). 

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11. H. T. Hai, J. G. Ahn, D. J. Kim, J. R. Lee, H. S. Chung and C. O. Kim, "Developing Process for Coating Copper Particles with Silver by Electroless Plating Method", Sur. Coat. Technol., 201, 3788 (2006). 

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12. Y.-S. Lin and S.-S. Chiu, "Electrical Properties of Copperfilled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper Particles", J. Adhes. Sci. Technol., 22, 1673 (2008). 

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13. M. Tsuji, S. Hikino, Y. Sano and M. Horigome, "Preparation of Cu@Ag Core-Shell Nanoparticles Using a Two-Step Polyol Process under Bubbling of $N_2$ Gas", Chem. Lett., 38(6), 518 (2009). 

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14. R. Zhang, W. Lin, K. Lawrence and C. P. Wong, "Highly Reliable, Low Cost, Isotropically Conductive Adhesives Filled with Ag-Coated Cu Flakes for Electronic Packaging Applications", Int. J. Adhes. Adhes., 30, 403 (2010). 

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15. X. G. Cao and H. Y. Zhang, "Fabrication and Performance of Silver Coated Copper Powder", Electron. Matter. Lett., 8(4), 467 (2012). 

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16. Y. Peng, C. Yang, K. Chen, S. R. Popuri, C.-H. Lee and B.-S. Tang, "Study on Synthesis of Ultrafine Cu-Ag Core-Shell Powders with High Electrical Conductivity", Appl. Sur. Sci., 263, 38 (2012). 

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17. A. Muzikansky, P. Nanikashvili, J. Grinblat and D. Zitoun, "Ag Dewetting in Cu@Ag Monodisperse Core-Shell Nanoparticles", J. Phys. Chem. C., 117, 3093 (2013). 

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18. S.-S. Chee and J.-H. Lee, 'Preparation and Oxidation Behavior of Ag-Coated Cu Nanoparticles Less Than 20 nm in Size", J. Mater. Chem. C., 2, 5372 (2014). 

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19. E. B. Choi and J.-H. Lee, "Ethylene Glycol-Based Ag Plating for the Wet Chemical Fabrication of One Micrometer Cu/Ag Core/Shell Particles, J. Alloys Compd., 643, S231 (2015). 

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20. J. Ryu, H.-S. Kim and H. T. Hahn, "Reactive Sintering of Copper Nanoparticles Using Intense Pulsed Light for Printed Electronic", J. Elecron. Mater., 40(1), 42 (2010). 

21. S.-J. Joo, H.-J. Hwang and H.-S. Kim, "Highly Conductive Copper Nano/microparticles Ink via Flash Light Sintering for Printed Electronics", Nanotechnology, 25, 265601 (2014). 

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23. Y. M. Shin, S.-S. Chee and J.-H. Lee, "Trends on Synthesis of Cu Nanoparticles by a Wet Reduction Method", J. Microelectron. Packag. Soc., 20(3), 11 (2013). 

24. Y. M. Shin and J.-H. Lee, "Effects of Process Parameters on Cu Powder Synthesis Yield and Particle Size in a Wet-chemical Process", Arch. Metall. Mater., 60 (2015). 

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