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NTIS 바로가기Journal of the Institute of Electronics and Information Engineers = 전자공학회논문지, v.53 no.7 = no.464, 2016년, pp.131 - 137
In this paper, we analyze the impedance analysis of vertical interconnection through-silicon vias (TSV) that is being studied for the purpose of improving the degree of integration and an electric feature in 3D IC. Also, it is to improve the performance and the degree of integration of the three-dim...
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Sung Kyu Lim, Design for High Performance, Low Power, and Reliable 3D Integrated Circuit, Springer Press, 2013, ch. 1.
Taigon Song et al. Lim. Analysis of TSV-to-TSV Coupling with High-Impedance Termination in 3D ICs. IEEE, 2011.
Taigon Song, Chang Liu, Yarui Peng, and Sung Kyu Lim, Full-Chip Multiple TSV-to-TSV Coupling Extraction and Optimization in 3D ICs. DAC'13, May 29-June 07 2013.
Yu-Jen Chang, Hao-Hsiang Chuang, Yi-Chang Lu, Yih-Peng Chiou, and Tzong-Lin Wu, Novel Crosstalk Modeling for Through-Silicon Vias (TSV) ON 3-D IC: Experimental Validation and Application to Faraday Cago Design, IEEE, 2012.
Jonghyun Cho et al. Active circuit to through silicon via (TSV) noise coupling. In IEEE Electrical Performance of Electronic Packaging and Systems, 2009.
Kihyun Yoon et al. Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer. In Proc. IEEE Electronics Packaging Technology Conf., 2009.
B. Curran, I. Ndip, S. Guttovski, and H. Reichl. The impacts of dimensions and return current path geometry on coupling in single-ended Through Silicon Vias. In IEEE Electronic Components and Technology Conference, 2009.
L. Cadix et al. Integration and frequency dependent electrical modeling of Through Silicon Vias (TSV) for high density 3D ICs. In International Interconnect Technology Conference, 2010.
Kim, Joohee, High-frequency Scalable Modeling of a Through Silicon Via (TSV) and Proposal of a Failure Detection Method of 3D ICs, Ph.D Dissertation, KAIST, 2013.
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