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NTIS 바로가기ETRI journal, v.38 no.6, 2016년, pp.1179 - 1189
Eom, Yong-Sung (ICT Material & Components Research Laboratory, ETRI) , Son, Ji-Hye (ICT Material & Components Research Laboratory, ETRI) , Bae, Hyun-Cheol (ICT Material & Components Research Laboratory, ETRI) , Choi, Kwang-Seong (ICT Material & Components Research Laboratory, ETRI) , Lee, Jin-Ho (ICT Material & Components Research Laboratory, ETRI)
A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of
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