$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Possibility of Al-Si Brazing Alloys for Industrial Microjoining Applications 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.24 no.3, 2017년, pp.35 - 40  

Sharma, Ashutosh (Dept. of Materials Science and Engineering, University of Seoul) ,  Jung, Jae Pil (Dept. of Materials Science and Engineering, University of Seoul)

Abstract AI-Helper 아이콘AI-Helper

Aluminium alloys have been used widely since hundreds of years in automotive joining. Silicon is an excellent alloying element that increases the fluidity, depresses the melting temperature and prevents shrinkage defects during solidification, and is cost effective raw material. In recent few decade...

주제어

AI 본문요약
AI-Helper 아이콘 AI-Helper

* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.

가설 설정

  • (3) Electrical and thermal properties: Aluminium alloys are highly electrically and thermally conductive. For example, the thermal conductivity of aluminium is approximately twice to that of copper of similar weight of both elements.
본문요약 정보가 도움이 되었나요?

참고문헌 (36)

  1. W. D. Callister, and D. G. Rethwisch, "Fundamentals of Materials Science and Engineering: An Integrated Approach", 4th Ed., pp. 542-594, John Wiley and Sons Inc., Wiley, USA (2012). 

  2. J. P. Mercier, G. Zambelli, and W. Kurz, "Introduction to Materials Science, Series in applied chemistry and materials sciences", Elsevier, Paris (2002). 

  3. I. J. Polmear, "Light alloys: From Traditional Alloys to Nanocrystals", 4th Ed., pp. 16-26, Elsevier, Butterworth Heinemann (2006). 

  4. B. Altshuller, "Aluminum Brazing Handbook", 4th Ed., pp. 24-32, The Aluminum Association, Inc., Washington D.C. (1990). 

  5. R. S. Rana, R. Purohit, and S. Das, "Review on the Influence of Alloying elements on the Microstructure and Mechanical Properties of Aluminum Alloys", Int. J. Sci. Res. Pub., 2 (6), 1 (2012). 

  6. W. S. Miller, and L. Zhuang, "Recent Development in Aluminium Alloys for the Automotive Industry", Mater. Sci. Eng. A, 280 (1), 37-49 (200). 

  7. M. D. Sabatino, S. Akhtar, and L. Arnberg, "State-of-The-Art Characterization Tools for Al Foundry Alloys", Metall. Sci. Technol., 30(1), 22 (2012). 

  8. H. Okamoto, "Desk Handbook: Phase Diagram for Binary Alloys", ASM International, United States (2010). 

  9. Y. Birol, "A Novel Al-Ti-B Alloy For Grain Refining Al-Si Foundry Alloys", J. Alloy Compd., 486, 219 (2009). 

  10. T. N. Ware, A. K. Dahle, S. Charles, and M. J. Couper, "Effect of Sr, Na, Ca & P on the Castability of Foundry Alloy A356.2", ASM Materials Solutions Conference & Exposition, Proc. 2nd International Aluminium Casting Technology Symposium (IACTS), Columbus, Ohio, USA (2002). 

  11. K. Nogita, S. D. McDonald, and A. K. Dahle, "Eutectic Modification of Al-Si Alloys with Rare Earth Metals", Mater. Trans., 45(2), 323 (2004). 

  12. A. Darvishi, A. Maleki, M. M. Atabaki, and M. Zargami, "The Mutual Effect of Iron and Manganese on Microstructure and Mechanical properties of Aluminium-Silicon Alloy", Association of Metallurgical Engineers of Serbia, MJoM, 16(1), 11 (2010). 

  13. P. Maldovan, and G. Popescu, "The Grain Refinement of 6061 Aluminium Using Al-5Ti-1B and Al-3Ti-0.15C Grain Refiners", JOM, 59-61 (2004). 

  14. S. R. Jain, Y. Vijayakumar, and S. V. Shankar, "Importance of Grain Refinement and Modification of Aluminium Alloys", IJSR, 3(6), 815 (2014). 

  15. S. A. Alidokht, A. Abdollah-Zadeh, S. Soleymani, T. Saeid, and H. Assadi, "Evaluation of Microstructure and Wear Behaviour of Friction Stir Processed Cast Aluminum Alloy", Mater. Charact., 63, 90 (2012). 

  16. A. Sharma, S. Bhattacharya, S. Das, H.-J. Fecht, and K. Das, "Development of Lead Free Pulse Electrodeposited Tin Based Composite Solder Coating Reinforced with ex-situ Cerium Oxide Nanoparticles", J. Alloy. Compd., 574, 609 (2013). 

  17. A. Sharma, S. Bhattacharya, S. Das, and K. Das, "Fabrication of Sn-Ag/ $CeO_2$ Electro-Composite Solder by Pulse Electrodeposition", Metall. Mater. Trans. A., 44A, 5587 (2013). 

  18. A. Sharma, H. R. Sohn, and J. P. Jung, "Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy", Metall. Mater. Trans. A., 47A, 494 (2016). 

  19. A. Sharma, M. H. Roh, and J. P. Jung, "Effect of $La_2O_3$ Nanoparticles on the Brazeability, Microstructure, and Mechanical Properties of Al-11Si-20Cu Alloy", JMEPEG, 25, 3538 (2016). 

  20. S. Bhattacharya, A. Sharma, S. Das, and K. Das, "Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ $ZrSiO_4$ Nanocomposite Coatings", Metall. Mater. Trans. A., 47(3), 1292 (2016). 

  21. A. Sharma, S. Das, and K. Das, "Electrochemical Corrosion Behavior of $CeO_2$ Nanoparticle Reinforced Sn-Ag Based Lead Free Nanocomposite Solders in 3.5 wt.% NaCl Bath", Surf. Coat. Technol., 261, 235 (2015). 

  22. D. H. Jung, A. Sharma, D. U. Lim, J. H. Yun, and J. P. Jung, "Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder", Metall. Mater. Trans. A., 48(9), 4372 (2017). 

  23. A. Sharma, D. E. Xu, J. Chow, M. Mayer, H. R. Sohn, and J. P. Jung, "Electromigration of Composite Sn-Ag-Cu Solder Bumps", Electron. Mater. Lett., 11(6), 1072 (2015). 

  24. A. Sharma, B. G. Baek, and J. P. Jung, "Influence of $La_2O_3$ Nanoparticle Additions on Microstructure, Wetting, and Tensile Characteristics of Sn-Ag-Cu Alloy", Mater. Des., 87, 370 (2015). 

  25. H. F. El-Labban, M. Abdelaziz, and E. R. I. Mahmoud, "Preparation and Characterization of Squeeze Cast-Al-Si Piston Alloy Reinforced by Ni and Nano- $Al_2O_3$ Particles", J. King Saud Univ. Eng. Sci., 28(2), 230 (2014). 

  26. H. Choi, and X. Li, "Refinement of Primary Si and Modification of Eutectic Si for Enhanced Ductility of Hypereutectic Al-20Si-4.5Cu Alloy with Addition of $Al_2O_3$ Nanoparticles", J. Mater. Sci., 47, 3096 (2012). 

  27. A. Sharma, and J. P. Jung, "Aluminium Based Brazing Fillers for High Temperature Electronic Packaging Applications", J. Microelectron. Packag. Soc., 22(4), 1 (2015). 

  28. A. Sharma, S. H. Lee, H. O. Ban, Y. S. Shin, and J. P. Jung, "Effect of Various Factors on the Brazed Joint Properties in Al Brazing Technology", J. Welding and Joining., 34(2), 30 (2016). 

  29. A. Sharma, M. H. Roh, D. H. Jung, and J. P. Jung, "Effect of $ZrO_2$ Nanoparticles on the Microstructure of Al-Si-Cu Filler for Low-Temperature Al Brazing Applications", Metall. Mater. Trans. A., 47(1), 510 (2016). 

  30. A. Sharma, Y. S. Shin, and J. P. Jung, "Influence of Various Additional Elements in Al Based Filler Alloys For Automotive and Brazing Industry", J. Welding and Joining., 33(5), 23 (2015). 

  31. A. Sharma, D. U. Lim, and J. P. Jung, "Microstructure and Brazeability of SiC Nanoparticles Reinforced Al-9Si-20Cu Produced by Induction Melting", Mater. Sci. Technol., 32(8), 773 (2016). 

  32. A. K. Srivastava, and A. Sharma, "Advances in Joining and Welding Technologies for Automotive and Electronic Applications", American Journal of Materials Engineering and Technology, 5(1), 7 (2017). 

  33. W. Dai, S.-B. Xue, F. Ji, J. Lou, B. Sun, and S. Q. Wang "Brazing 6061 aluminum alloy with Al-Si-Zn filler metals containing Sr", Int. J. Miner. Met. Mater., 20, 365 (2013). 

  34. Z. Niu, J. Huang, H. Yang, S. Chen, and X. Zhao "Preparation and properties of a novel Al-Si-Ge-Zn filler metal for brazing aluminum", J. Mater. Eng. Perform., 24(6), 2327 (2015). 

  35. D.M. Jacobson, G. Humpston, and S. P. S. Sangha "A New Low Melting Point Aluminium Braze", Welding Research Supplement, 75(8), 243s (1996). 

  36. A. Sharma, S. Mallik, N. N. Ekere, and J. P. Jung, "Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes", J. Microelectron. Packag. Soc., 21(4), 83 (2014). 

LOADING...

관련 콘텐츠

오픈액세스(OA) 유형

GOLD

오픈액세스 학술지에 출판된 논문

이 논문과 함께 이용한 콘텐츠

저작권 관리 안내
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로