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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.4, 2021년, pp.91 - 96
이나영 (경북대학교 미래과학기술융합학과) , 예성욱 (경북대학교 나노소재공학부) , (한국세라믹기술원 에너지환경본부) , 탁장렬 (한국세라믹기술원 에너지환경본부) , 조중영 (한국세라믹기술원 에너지환경본부) , 서원선 (연세대학교 신소재공학과) , 신원호 (광운대학교 전자재료공학과) , 남우현 (한국세라믹기술원 에너지환경본부) , 노종욱 (경북대학교 미래과학기술융합학과)
The enhancement of thermoelectric figure of merit was achieved by the simple processes of sieving and high energy ball milling, respectively, which are enable to reduce the grain size of n-type Bi2Te3 thermoelectric materials. By optimizing the grain size, the electrical conductivities and thermal c...
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