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NTIS 바로가기전기전자재료학회논문지 = Journal of the Korean institute of electronic material engineers, v.34 no.3, 2021년, pp.178 - 185
이지수 (인하대학교 화학공학과) , 임은택 (인하대학교 화학공학과) , 차문환 (인하대학교 화학공학과) , 박성용 (인하대학교 화학공학과) , 정지원 (인하대학교 화학공학과)
Inductively coupled plasma reactive ion etching (ICP-RIE) of copper thin films patterned with SiO2 hard masks was carried out using piperidine/O2/Ar gas mixture. The etch rate, etch selectivity, and etch profile of copper thin films were investigated by varying gas concentration in piperidine/O2/Ar ...
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