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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.2, 2021년, pp.65 - 70
안병진 (한국생산기술연구원) , 천경영 (한국생산기술연구원) , 김자현 (한국생산기술연구원) , 김정수 (한국생산기술연구원) , 김민수 (한국생산기술연구원) , 유세훈 (한국생산기술연구원) , 박영배 (안동대학교 신소재공학과) , 고용호 (한국생산기술연구원)
In this study, interfacial properties and mechanical properties of joints were reported after Cu pads finished with organic solderability preservative (OSP) on flame retardant-4 (FR-4) printed circuit board (PCB) and electronic components were joined with a Sn-57Bi-1Ag solder paste by using a laser ...
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