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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.2, 2021년, pp.95 - 103
김병우 (조선대학교 용접.접합과학공학과) , 최혁기 (조선대학교 용접.접합과학공학과) , 전혜원 (조선대학교 용접.접합과학공학과) , 이도영 (조선대학교 용접.접합과학공학과) , 손윤철 (조선대학교 용접.접합과학공학과)
Sn-58Bi-xRu composite solders were prepared by adding Ru nanoparticles to Sn-58Bi, a typical low-temperature solder, and the interfacial reaction and solder joint reliability were analyzed by reacting with Cu/OSP and ENIG surface treated PCB boards. The Cu6Sn5 IMC formed by the reaction with Cu/OSP ...
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