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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.2, 2021년, pp.51 - 57
장서현 (인하대학교 공과대학 기계공학과) , 한유수 (인하대학교 공과대학 기계공학과) , 황도순 (한국항공우주연구원) , 정주원 (한국항공우주연구원) , 김영국 (인하대학교 메카트로닉스공학과)
This paper analyzed the effects of the concentration of nano-silica particles contained in epoxy resin on the thermomechanical properties of the composite materials. The 12nm sized nanoparticles were mixed with epoxy polymer by 5 different weight ratios for the test samples. The glass transition tem...
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