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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.3, 2021년, pp.9 - 15
박승민 (서울과학기술대학교, MSDE학과) , 김윤호 (서울과학기술대학교, MSDE학과) , 김사라은경 (서울과학기술대학교, 나노IT융합공학과)
Miniaturization of semiconductor devices has recently faced a physical limitation. To overcome this, 3D packaging in which semiconductor devices are vertically stacked has been actively developed. 3D packaging requires three unit processes of TSV, wafer grinding, and bonding, and among these, copper...
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