[논문]열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석

변상원; 김영신; 전의식

열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석
Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation 원문보기

반도체디스플레이기술학회지 = Journal of the semiconductor & display technology, v.21 no.1, 2022년, pp.148 - 154

변상원 (공주대학교 일반대학원 기전공학과, (주)마이크로컨텍솔루션) , 김영신 (공주대학교 생산기술연구소) , 전의식 (공주대학교 일반대학원 미래융합공학과, 공주대학교 생산기술연구소)

Abstract ▼ AI-Helper

As the 4th industrial age approaches, the demand for semiconductors is increasing enough to be used in all electronic devices. At the same time, semiconductor technology is also developing day by day, leading to ultraprecision and low power consumption. Semiconductors that keep getting smaller generate heat because the energy density increases, and the generated heat changes the shape of the semiconductor package, so it is important to manage. The temperature change is not only self-heating of the semiconductor package, but also heat generated by external damage. If the package is deformed, it is necessary to manage it because functional problems and performance degradation such as damage occur. The package burn in test in the post-process of semiconductor production is a process that tests the durability and function of the package in a high-temperature environment, and heat dissipation performance can be evaluated. In this paper, we intend to review a new material formulation that can improve the performance of the adapter, which is one of the parts of the test socket used in the burn-in test. It was confirmed what characteristics the basic base showed when polyamide, a high-molecular material, and alumina, which had high thermal conductivity, were mixed for each magnification. In this study, functional evaluation was also carried out by injecting an adapter, a part of the test socket, at the same time as the specimen was manufactured. Verification of stiffness such as tensile strength and flexural strength by mixing ratio, performance evaluation such as thermal conductivity, and manufacturing of a dummy device also confirmed warpage. As a result, it was confirmed that the thermal stability was excellent. Through this study, it is thought that it can be used as basic data for the development of materials for burn-in sockets in the future.

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참고문헌 (11)

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상세보기
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열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석
Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation 원문보기

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열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석 Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation 원문보기

Abstract ▼ AI-Helper

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김영신 (12) 전의식 (38)

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열변형 저감을 위한 고분자 복합소재 배합 조건에 따른 재료특성 분석
Analysis of Material Properties According to Compounding Conditions of Polymer Composites to Reduce Thermal Deformation 원문보기