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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.59 - 64
이현철 ((주)스태츠칩팩코리아) , 배병현 ((주)비츠로테크) , 손기락 (한국전자통신연구원 DMC융합연구단) , 김가희 (안동대학교 신소재공학부 청정에너지소재기술연구센터) , 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)
Effects of film stack structure and peeling rate on the peel strength of screen-printed (SP) Ag/polyimide (PI) systems were investigated by a 90° peel test. When PI film was peeled at PI/SP-Ag and PI/SP-Ag/electroplated (EP) Cu structures, the peel strength was nearly constant regardless of t...
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