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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.11 - 18
홍태영 (조선대학교 용접.접합과학공학과) , 심호률 (조선대학교 용접.접합과학공학과) , 손윤철 (조선대학교 용접.접합과학공학과)
Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and dur...
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