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플렉시블 전자소자의 유연전도성 접합 기술
Soft Interconnection Technologies in Flexible Electronics 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.33 - 41  

이우진 (서울대학교 재료공학부) ,  이승민 (서울대학교 재료공학부) ,  강승균 (서울대학교 재료공학부)

초록
AI-Helper 아이콘AI-Helper

최근 플렉시블 전자소자의 안정적인 전기적 연결을 위한 유연전도성 접합 기술의 연구 필요성이 대두되고 있다. 기존의 금속 납땜 접합에서 발생하는 기계적 파손 문제는 탄성 계수가 작거나 두께가 얇은 재료를 기반으로 제작된 유연전도성 접합을 통해 해결할 수 있다. 기계적 특성을 향상시키는 동시에 안정적인 전기적 연결이 가능하도록 높은 전기전도도를 가진 물질을 박막화하거나, 작은 탄성 계수를 가진 물질에 혼합하는 방식 등으로 형성된다. 대표적인 유연전도성 접합 기술로는 박막 증착을 통한 유연전도성 접합, 유연 전도성 접착제 기반 접합, 그리고 액체 금속 기반의 전도성 접합 형성 방법 등이 있으며 본 논문에서는 각 방법들의 기계적/전기적 특성 향상 전략과 그 쓰임을 소개한다.

Abstract ▼ AI-Helper 아이콘AI-Helper

Recent necessities of research have emerged about soft interconnection technologies for stable electric connections in flexible electronics. Mechanical failure in conventional metal solder interconnection can be solved as soft interconnections based on a small elastic modulus and a thin thickness. T...

주제어

#Soft interconnections   #Flexible electronics   #Thin-film metallization   #Flexible conductive adhesives   #Liquid metal interconnections  

표/그림 (3)

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