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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.3, 2022년, pp.43 - 48
김헌수 (한양대학교 융합기계공학과) , 김학성 (한양대학교 융합기계공학과)
In this study, simulation method was developed to improve the accuracy of the warpage simulation based on the equivalent anisotropic viscoelastic model. First, a package with copper traces and bumps was modeled to implement anisotropic viscoelastic behavior. Then, equivalent anisotropic viscoelastic...
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