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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.1, 2023년, pp.90 - 94
정건주 (한국생산기술연구원 탄소경량소재응용연구그룹) , 김태유 (한국생산기술연구원 탄소경량소재응용연구그룹) , 정승부 (성균관대학교 신소재공학과) , 김광석 (한국생산기술연구원 탄소경량소재응용연구그룹)
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