[논문]FOWLP Cu 재배선 적용을 위한 절연층 경화 온도 및 고온/고습 처리가 Ti/PBO 계면접착에너지에 미치는 영향

손기락; 김가희; 박영배

doi:10.6117/kmeps.2023.30.2.0052

FOWLP Cu 재배선 적용을 위한 절연층 경화 온도 및 고온/고습 처리가 Ti/PBO 계면접착에너지에 미치는 영향
Effects of Dielectric Curing Temperature and T/H Treatment on the Interfacial Adhesion Energies of Ti/PBO for Cu RDL Applications of FOWLP 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.2, 2023년, pp.52 - 59

손기락 ((유) 스태츠칩팩코리아) , 김가희 (안동대학교 신소재공학부 청정에너지소재기술연구센터) , 박영배 (안동대학교 신소재공학부 청정에너지소재기술연구센터)

초록
AI-Helper

팬 아웃 웨이퍼 레벨 패키지의 Cu 재배선층 적용을 위해 Ti 확산방지층과 폴리벤즈옥사졸(polybenzoxazole, PBO) 절연층 사이의 계면 신뢰성을 평가하였다. PBO 경화 온도 및 고온/고습 시간에 따라 4점 굽힘 시험으로 정량적인 계면접착에너지를 평가하였고, 박리계면을 분석하였다. 175, 200, 및 225℃의 세 가지 PBO 경화 온도에 따른 계면접착에너지는 각각 16.63, 25.95, 16.58 J/m² 로 200℃의 경화 온도에서 가장 높은 값을 보였다. 박리표면에 대한 X-선 광전자 분광분석 결과, 200℃에서 PBO 표면의 C-O 결합의 분율이 가장 높으므로, M-O-C 결합이 Ti/PBO 계면접착 기구와 연관성이 높은 것으로 판단된다. 200℃에서 경화된 시편을 85℃/85% 상대 습도에서 500시간 동안 고온/고습 처리 하는 동안 계면접착에너지는 3 .99 J/m²까지 크게 감소하였다. 이는 고온/고습 처리동안 Ti/PBO 계면으로의 지속적인 수분 침투로 인해 계면 근처 PBO의 화학결합이 약해져서 weak boundary layer를 형성하기 때문으로 판단된다.

Abstract ▼ AI-Helper

The effects of dielectric curing temperature and temperature/humidity treatment conditions on the interfacial adhesion energies between Ti diffusion barrier/polybenzoxazole (PBO) dielectric layers were systematically investigated for Cu redistribution layer applications of fan-out wafer level package. The initial interfacial adhesion energies were 16.63, 25.95, 16.58 J/m2 for PBO curing temperatures at 175, 200, and 225 ℃, respectively. X-ray photoelectron spectroscopy analysis showed that there exists a good correlation between the interfacial adhesion energy and the C-O peak area fractions at PBO delaminated surfaces. And the interfacial adhesion energies of samples cured at 200 ℃ decreased to 3.99 J/m2 after 500 h at 85 ℃/85 % relative humidity, possibly due to the weak boundary layer formation inside PBO near Ti/PBO interface.

주제어

표/그림 (13)

그림 Fig. 1. Schematic of four-point bending test specimen with Si/adhesive/Cu/Ti/PBO/Si structure.
그림 Fig. 2. A typical load vs. displacement curve obtained from the four-point bending test.
그림 Fig. 3. Effect of PBO curing temperatures on the interfacial adhesion energies between Ti/PBO interface.
그림 Fig. 4. Effect of PBO curing temperatures on the SEM images and EDS results of the delaminated surfaces after the four-point bending test; (a) 175℃, (b) 200℃, and (c) 225℃.
그림 Fig. 5. Effect of PBO curing temperatures on the XPS wide-scan spectra at the delaminated surfaces; (a) upper side and (b) lower side.
그림 Fig. 6. Effect of PBO curing temperatures on the XPS Gaussian peak fitting of C 1s peak at the delaminated lower surfaces.
$Fig. 7. Correlations between C-O peak area fraction at the PBO surfaces and the interfacial adhesion energies with respect to PBO curing temperatures.$ 그림 Fig. 7. Correlations between C-O peak area fraction at the PBO surfaces and the interfacial adhesion energies with respect to PBO curing temperatures.
그림 Fig. 8. Effects of 85℃/85% R.H. treatment times on the interfacial adhesion energies between Ti/PBO interface.
$Table 1. Effect of PBO curing temperatures on the XPS peak area fractions of C 1s core-level spectra at the delaminated lower surfaces.$ 표 Table 1. Effect of PBO curing temperatures on the XPS peak area fractions of C 1s core-level spectra at the delaminated lower surfaces.
그림 Fig. 9. Effects of 85℃/85% R.H. treatment times on the SEM images and EDS results of the delaminated surfaces; (a) 24 h, (b) 100 h, (c) 200 h, and (d) 500 h.
그림 Fig. 10. Effects of 85℃/85% R.H. treatment times on the XPS Gaussian peak fitting of C 1s peak at the delaminated lower surfaces.
$Table 2. Effect of 85℃/85% R.H. treatment times on the XPS peak area fractions of C 1s core-level spectra at the delaminated lower surfaces.$ 표 Table 2. Effect of 85℃/85% R.H. treatment times on the XPS peak area fractions of C 1s core-level spectra at the delaminated lower surfaces.
$Fig. 11. Correlations between C-O peak area fraction at the PBO surfaces and the interfacial adhesion energies with respect to 85℃/85% R.H. treatment times.$ 그림 Fig. 11. Correlations between C-O peak area fraction at the PBO surfaces and the interfacial adhesion energies with respect to 85℃/85% R.H. treatment times.

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