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FOWLP(Fan-out Wafer Level Packaging) 공정의 플라즈마 응용 기술
Plasma Application Technology of FOWLP (Fan-out Wafer Level Packaging) Process 원문보기

마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.30 no.1, 2023년, pp.42 - 48  

박세용 (한국공학대학교 신소재공학과) ,  이성의 (한국공학대학교 신소재공학과) ,  이희철 (한국공학대학교 신소재공학과) ,  김성용 (한국공학대학교 전자공학과) ,  박남선 ((주)제4기한국) ,  김경민 (한국공학대학교 신소재공학과)

초록
AI-Helper 아이콘AI-Helper

최근 모바일, IoT, 차량 등의 많은 산업군에서 발생하는 다양한 종류의 신호 및 전력 요구가 증가함에 따라 그에 맞는 성능 향상과 소형화에 대한 요구가 높아지고 있는 상황이다. 이러한 추세에 따라 고성능의 칩이 필요해지고 이러한 칩을 패키징 할 수 있는 고급 패키지 기술의 개발 필요성이 높아지고 있는 상황이다. 이러한 상황에서 FOWLP 공정 기술은 이에 맞는 적합한 기술이며 이 공정에서의 부족한 점을 개선하기 위하여 사용되고 연구되고 있는 플라즈마 응용 기술들에 대하여 본 논문에서 알아보았으며 크게 4가지 부분으로 나누어 각 부분에서 사용되는 플라즈마 응용 기술들에 대한 소개와 연구 사례를 설명한다.

Abstract ▼ AI-Helper 아이콘AI-Helper

Recently, there has been an increasing demand for performance improvement and miniaturization in response to the growing variety of signals and power demands in many industries such as mobile, IoT, and automotive. As a result, there is a high demand for high-performance chips and advanced packaging ...

주제어

#FOWLP(Fan-out wafer level packaging)   #Plasma   #Packaging   #PCB(Printed Circuit Board)  

표/그림 (8)

참고문헌 (47)

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