[논문]광 반응성기를 갖는 아크릴 점착제의 합성과 반도체 다이싱 테이프로의 적용 연구

박희웅; 장남규; 권기옥; 신승한

doi:10.14478/ace.2023.1065

광 반응성기를 갖는 아크릴 점착제의 합성과 반도체 다이싱 테이프로의 적용 연구
Synthesis of Pressure-sensitive Acrylic Adhesives with Photoreactive Groups and Their Application to Semiconductor Dicing Tapes 원문보기

공업화학 = Applied chemistry for engineering, v.34 no.5, 2023년, pp.522 - 528

박희웅 (한국생산기술연구원 청정기술연구소 친환경융합소재연구부문) , 장남규 (한국생산기술연구원 청정기술연구소 친환경융합소재연구부문) , 권기옥 (한국생산기술연구원 청정기술연구소 친환경융합소재연구부문) , 신승한 (한국생산기술연구원 청정기술연구소 친환경융합소재연구부문)

초록
AI-Helper

반도체 제조공정인 다이싱 공정용 점착 테이프를 제조하기 위해 다양한 개수의 광 반응기를 갖는 화합물을 합성하였고 아크릴 공중합체에 도입하여 UV 경화형 아크릴 점착제를 제조하였다. 합성된 광반응성 화합물(f = 2 또는 3)의 구조는 NMR을 이용하여 확인하였다. 광반응성 화합물(f = 1~3)은 우레탄 반응을 통해 아크릴 점착제의 곁가지로 도입되었고, FT-IR 측정을 통해 UV 경화형 아크릴 점착제가 성공적으로 합성되었음을 확인하였다. UV 조사 전 후의 박리강도 변화는 실리콘 웨이퍼를 기재로 하여 평가되었으며, UV 조사 전 점착제의 높은 박리강도(~2000 gf/25 mm)가 UV조사 후 크게 감소(~5 gf/25 mm)하였다. 다 관능성 광 반응기가 도입된 점착제의 점착력 감소 효과가 가장 컸으며 FE-SEM을 통한 표면 잔류물 측정 결과, UV 조사 후의 표면 잔류물도 매우 낮은 수준(~0.2%)으로 관찰되었다.

Abstract ▼ AI-Helper

In this work, adhesive tapes were prepared for the dicing process in semiconductor manufacturing. Compounds with different numbers of photoreactive groups (f = 1 to 3) were synthesized and incorporated into acrylic copolymers to formulate UV-curable acrylic adhesives. Structural confirmation of the synthesized photoreactive compounds (f = 2 or 3) was performed using nuclear magnetic resonance (NMR) spectroscopy. The introduction of the photoreactive compounds into the acrylic adhesive was accomplished by urethane reactions, and the successful synthesis of the UV-curable acrylic adhesive was verified by Fourier transform infrared (FT-IR) measurements. To evaluate the performance of the adhesive, the peel strength was evaluated before and after UV irradiation using a silicon wafer as a substrate. The adhesive exhibited high peel strength (~2000 gf/25 mm) before UV exposure, which was significantly reduced (~5 gf/25 mm) after UV exposure. Interestingly, the adhesive containing multifunctional photoreactive compounds showed the most significant reduction in peel strength. In addition, surface residue measurements by field emission scanning electron microscopy (FE-SEM) showed minimal surface residue (~0.2%) after UV exposure. Overall, these results contribute to the understanding of the behavior of UV-curable acrylic adhesives and pave the way for potential applications in semiconductor manufacturing processes.

주제어

표/그림 (11)

그림 Figure 1. ¹H NMR spectrum of purified PETA.
그림 Figure 2. Synthesis of isocyanate-terminated multifunctional acryl monomers (a) NAMP, (b) NPETA.
그림 Figure 3. 1H NMR spectra of isocyanate terminated photoreactive monomer (a) NAMP, (b) NPETA
그림 Figure 4. Synthesis of photoreactive acrylic copolymer.
그림 Figure 5. FT-IR Spectra of NAMP and NPETA.
표 Table 1. Detailed Composition of Photocurable PSA
그림 Figure 6. FT-IR Spectra of photoreactive PSA.
그림 Figure 7. 180° peel strength of photoreactive PSA (a) Peel strength change according to the amount of photoreactive monomer introduced (b) Peel strength change of photoreactive PSA irradiated with UV 1 J/cm² (c) Peel strength change according to UV dose.
표 Table 2. General Information of Photoreactive PSA
그림 Figure 8. SEM images and converted images of the silicon wafer surface after peel strength measurement (×100).
표 Table 3. Surface Residue on Silicon Wafer after Peel Strength Measurement (%)

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