참고문헌 (10)

1. INNOPOLIS Foundation, Automotive Electronic Control System Market. https://www.innopolis.or.kr/board/view?pageNum=57&rowCnt=10&no1=227&linkId=44090&&menuId=MENU00999&schType=0&schText=&categoryId=03&continent= 

2. Kang, Gi-Bong. A Law and Policy Study on Tuning of Automotive Electronic Control Units(ECU). 漢陽法學 = Hanyang law review, vol.31, no.3, 145-168.

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3. Ha, S.-S., Kim, J.-W., Chae, J.-H., Moon, W.-C., Hong, T.-H., Yoo, C.-S., Moon, J.-H., Jung, S.-B., (2006), Thermo-mechanical reliability of lead-free surface mount assemblies for auto-mobile application, Journal of Welding and Joining, 24(6), 21-27. 

4. Jeon, Y.-J., Kim, D.-S., Shin, Y.-E., (2011), A study on the fracture mode characteristics of automotive application component lead-free solder joints, Transactions of the Korean Society of Automotive Engineers, 19(6), 90-96. 

5. Hampshire, W.B.. The Search for Lead‐free Solders. Soldering & surface mount technology : journal of the SMART (Surface Mount & Related Technologies) Group, vol.5, no.2, 49-52.

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6. ES95400-10, (2019), Environmental test for automotive electronic devices. 

7. 10.1115/1.4015020 

   

8. Manson, S. S., (1953), Behavior of materials under conditions of thermal stress, National Advisory Committee for Aeronautics. 

9. JIS Z 3198-7, (2003), Test methods for lead-free solders - Part 7: Methods for shear strength of solder joints on chip components, Japanese Standards Association (JSA). 

10. JIS Z 3198-6, (2003), Test methods for lead-free solders - Part 6: Methods for 45 degree pull test of solder joints on QFP lead, Japanese Standards Association (JSA). 

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