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NTIS 바로가기Microelectronic engineering, v.86 no.1, 2009년, pp.72 - 77
Musschoot, J. (Department of Solid State Sciences, Ghent University, Krijgslaan 281) , Xie, Q. (State Key Laboratory of ASIC and Systems, Department of Microelectronics, Fudan University, Shanghai 200433, China) , Deduytsche, D. (Department of Solid State Sciences, Ghent University, Krijgslaan 281) , Van den Berghe, S. (Laboratory for High and Medium Activity, SCK CEN, Boeretang 200, B-2400 Mol, Belgium) , Van Meirhaeghe, R.L. (Department of Solid State Sciences, Ghent University, Krijgslaan 281) , Detavernier, C. (Department of Solid State Sciences, Ghent University, Krijgslaan 281)
AbstractTiN was grown by atomic layer deposition (ALD) from tetrakis(dimethylamino)titanium (TDMAT). Both thermal and plasma enhanced processes were studied, with N2 and NH3 as reactive gases. Using an optimized thermal ammonia based process, a growth rate of 0.06nm/cycle and a resistivity of 53&tim...
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