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NTIS 바로가기IEEE transactions on semiconductor manufacturing : a publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society,, v.27 no.3, 2014년, pp.377 - 387
Beom-suk Chung , Junseok Lim , In-Beom Park , Jonghun Park , Minseok Seo , Jinwook Seo
Semiconductor manufacturers are increasingly assembling multiple chips into a single package to maximize the capacity of flash memories. Multiple-chip products (MCPs) require repetitive visits to assembly stages and incur frequent setup changes. As utilization of packaging facilities decreases due t...
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