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ACS applied materials & interfaces, v.8 no.39, 2016년, pp.26119 - 26125
Wen, Liang Gong (imec, Kapeldreef 75, 3001 Leuven,) , Roussel, Philippe (imec, Kapeldreef 75, 3001 Leuven,) , Pedreira, Olalla Varela (imec, Kapeldreef 75, 3001 Leuven,) , Briggs, Basoene (imec, Kapeldreef 75, 3001 Leuven,) , Groven, Benjamin (imec, Kapeldreef 75, 3001 Leuven,) , Dutta, Shibesh (imec, Kapeldreef 75, 3001 Leuven,) , Popovici, Mihaela I. (imec, Kapeldreef 75, 3001 Leuven,) , Heylen, Nancy (imec, Kapeldreef 75, 3001 Leuven,) , Ciofi, Ivan (imec, Kapeldreef 75, 3001 Leuven,) , Vanstreels, Kris (imec, Kapeldreef 75, 3001 Leuven,) , sterberg, Frederik W. (Department of Micro- and Nanotechnology, Technical University of Denmark, rsteds Plads, 2800 Kgs. Lyngby,) , Hansen, Ole (Department of Micro- and Nanotechnology, Technical University of Denmark, rsteds Plads, 2800 Kgs. Lyngby,) , Petersen, Dirch H. (Department of Micro- and Nanotechnology, Technical University of Denmark, rsteds Plads, 2800 Kgs. Lyngby,) , Opsomer, Karl (imec, Kapeldreef 75, 3001 Leuven,) , Detavernie, Christophe (Department of Solid-State Sciences, Ghent University, Krijgslaan 281, 9000 Gent,) , Wilson, Christopher J. (imec, Kapeldreef 75, 3001 Leuven,) , Elshocht, Sven Van (imec, Kapeldreef 75, 3001 Leuven,) , Croes, Kristof (imec, Kapeldreef 75, 3001 Leuven,) , Bommels, Jurgen (imec, Kapeldreef 75, 3001 Leuven,) , Tokei, Zsolt (imec, Kapeldreef 75, 3001 Leuven,) , Adelmann, Christoph (imec, Kapeldreef)
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Atomic layer deposition of ruthenium is studied as a barrierless metallization solution for future sub-10 nm interconnect technology nodes. We demonstrate the void-free filling in sub-10 nm wide single damascene lines using an ALD process in combination with 2.5 of ALD TiN interface and postdeposit...
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