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NTIS 바로가기Interconnect Technology Conference (IITC), 2021 IEEE International, 2021 July 6, 2021년, pp.1 - 3
Li, Ming-Jui (Georgia Institute of Technology, Atlanta, GA, USA) , Breeden, Michael (University of California San Diego, La Jolla, CA, USA) , Wang, Victor (University of California San Diego, La Jolla, CA, USA) , Linn, Nyi Myat Khine (Wayne State University, Detroit, MI, USA) , Winter, Charles H. (Wayne State University, Detroit, MI, USA) , Kummel, Andrew (University of California San Diego, La Jolla, CA, USA) , Bakir, Muhannad S. (Georgia Institute of Technology, Atlanta, GA, USA)
A Cu-Cu bonding approach using low temperature (200 °C) selective Co ALD is demonstrated for Cu pads that are separated by 200 nm. The bonding testbed is characterized before and after Co ALD by SEM and EDS to confirm the feasibility of the approach. AFM and XPS are used to measure the select...
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