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NTIS 바로가기IEEE transactions on electron devices, v.64 no.5, 2017년, pp.2072 - 2079
Kim, JungHun (Semiconductor Research Center, Samsung Electronics, Yongin, South Korea) , Huynh, Hai Au (College of Information and Communication Engineering, Sungkyunkwan University, Suwon, South Korea) , Kim, SoYoung
In this paper, we introduce a new compact model of the parasitic resistance of a FinFET with a hexagonal-shaped raised source-drain (S/D) structure. In contrast to previousmodels that divided the extrinsic S/D region into three parts, we redefined the region boundaries and modeled them as a series c...
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Coss, B. E., Smith, C., Wei-Yip Loh, Majhi, P., Wallace, R. M., Kim, J., Jammy, R.. Contact Resistance Reduction to FinFET Source/Drain Using Novel Dielectric Dipole Schottky Barrier Height Modulation Method. IEEE electron device letters : a publication of the IEEE Electron Devices Society, vol.32, no.7, 862-864.
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Masetti, G., Severi, M., Solmi, S.. Modeling of carrier mobility against carrier concentration in arsenic-, phosphorus-, and boron-doped silicon. IEEE transactions on electron devices, vol.30, no.7, 764-769.
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Proc ITC-CSCC The effect of contact boundary on bulk resistance in hexagonal shaped source/drain in FinFETs kim 2015 366
Dixit, A., Kottantharayil, A., Collaert, N., Goodwin, M., Jurczak, M., De Meyer, K.. Analysis of the parasitic S/D resistance in multiple-gate FETs. IEEE transactions on electron devices, vol.52, no.6, 1132-1140.
Ng, K.K., Lynch, W.T.. Analysis of the gate-voltage-dependent series resistance of MOSFET's. IEEE transactions on electron devices, vol.33, no.7, 965-972.
Chang-Woo Sohn, Chang Yong Kang, Myung-Dong Ko, Do-Young Choi, Hyun Chul Sagong, Eui-Young Jeong, Chan-Hoon Park, Sang-Hyun Lee, Ye-Ram Kim, Chang-Ki Baek, Jeong-Soo Lee, Lee, J. C., Yoon-Ha Jeong. Analytic Model of S/D Series Resistance in Trigate FinFETs With Polygonal Epitaxy. IEEE transactions on electron devices, vol.60, no.4, 1302-1309.
Tekleab, D., Samavedam, S., Zeitzoff, P.. Modeling and Analysis of Parasitic Resistance in Double-Gate FinFETs. IEEE transactions on electron devices, vol.56, no.10, 2291-2296.
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