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NTIS 바로가기Journal of alloys and compounds, v.820, 2020년, pp.153396 -
Kim, Jungsoo (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH)) , Jung, Seung-Boo (School of Advanced Materials Science & Engineering, Sungkyunkwan University) , Yoon, Jeong-Won (Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH))
Abstract We analyzed the effects of phosphorous (P) in a palladium (Pd) layer on the interfacial reactions and mechanical properties of Sn–58Bi solder with thin electroless-nickel electroless-palladium immersion gold (ENEPIG) joints (pure Pd and Pd(P) joints) after a high-temperature storage ...
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