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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.28 no.1, 2021년, pp.31 - 37
김장백 (서울시립대학교 신소재공학과) , 서성민 (서울시립대학교 신소재공학과) , 강혜준 (서울시립대학교 신소재공학과) , 조도훈 (서울시립대학교 신소재공학과) , 스리 하리니 라젠드란 (서울시립대학교 신소재공학과) , 정재필 (서울시립대학교 신소재공학과)
Sn-3wt%Ag-0.5wt%Cu (SAC305) solder is most popular solder in electronics industry. However, SAC305 has also drawbacks such as growth of β-Sn phase, intermetallic compounds (IMCs) of Ag3Sn, Cu6Sn5 and Cu3Sn which can result in deterioration of solder joints in terms of metallurgically, mechanica...
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