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NTIS 바로가기Electronic Packaging Technology (ICEPT), 2020 21st International Conference on, 2020 Aug, 2020년, pp.1 - 3
Li, Zesheng (Guangdong University of Technology,School of Electromechanical Engineering,Guangzhou,China) , He, Yunbo (Guangdong University of Technology,School of Electromechanical Engineering,Guangzhou,China)
The key problem that needs to be overcome in the industrialization process of MicroLED today is the mass transfer of MicroLED. Most of the current mass transfer methods cannot solve the problem that the distance between the MicroLED on the wafer and the target substrate in the X and Y directions is ...
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