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PROBLEM TO BE SOLVED: To provide a wafer conveyance system capable of simply and surely peeling off a wafer from a placing position, holding the wafer and conveying the wafer without generating failure such as dirt.SOLUTION: A wafer conveyance system for conveying a wafer W vacuum chucked on a chuck

PROBLEM TO BE SOLVED: To provide a wafer conveyance system capable of simply and surely peeling off a wafer from a placing position, holding the wafer and conveying the wafer without generating failure such as dirt.SOLUTION: A wafer conveyance system for conveying a wafer W vacuum chucked on a chuck table 12 from the chuck table 12 to another place includes: wafer floating means for floating the wafer W from the surface of the chuck table 12 by jetting water from the chuck table 12 side to the wafer W released from vacuum chuck; wafer clamp holding means having a clamp claw portion 21 for holding the wafer W by clamping an edge portion of the floated wafer W; air supply means for jetting air from the chuck table 12 side to the wafer W held by the clamp claw portion 21 to remove water between the wafer W and the chuck table 12; and conveyance means for conveying the wafer W held by the clamp claw portion 21 to a desired position together with the clamp claw portion 21.

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