IPC분류정보
국가/구분 |
United States(US) Patent
공개
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0353326
(2003-01-28)
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공개번호 |
US-0033769
(2004-02-19)
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발명자
/ 주소 |
- Zuniga, Steven M.
- Birang, Manoocher M.
- Chen, Hung M.
- Ko, Sen-Hou M.
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출원인 / 주소 |
- Applied Materials, Inc., a Delaware corporation
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
0 |
초록
▼
A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, ann
A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.
대표청구항
▼
1. A carrier head for positioning a substrate on a polishing surface, comprising:a housing connectable to a drive shaft to rotate therewith; a base; a loading mechanism connecting the housing to the base to apply a downward pressure to the base; a gimbal mechanism pivotally connecting the housing to
1. A carrier head for positioning a substrate on a polishing surface, comprising:a housing connectable to a drive shaft to rotate therewith; a base; a loading mechanism connecting the housing to the base to apply a downward pressure to the base; a gimbal mechanism pivotally connecting the housing to the base to permit the base to pivot with respect to the housing about an axis substantially parallel to the polishing surface; a support structure positioned below the base; a substantially horizontal, annular flexure having an outer circumferential portion attached to the base and an inner circumferential portion attached to the support structure; a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define, in conjunction with the base, the support structure and the flexure, a chamber; and a retaining ring connected to the base and surrounding the flexible membrane. 2. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a support structure connected to the base by a flexure; and a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a chamber. 3. The carrier head of claim 2 further comprising an upper clamp and a lower clamp, and wherein the flexure is secured between the upper clamp and the lower clamp and the membrane is secured between the lower clamp and the support structure. 4. The carrier head of claim 2 wherein the flexure extends over an outer circumferential portion of the support structure, and a gap separates the flexure from the outer circumferential portion of the support structure. 5. The carrier head of claim 4 wherein the base has a passageway connecting the gap to an outer surface of the base. 6. The carrier head of claim 2 wherein the chamber includes a first portion located above the support-structure and a second portion located below the support structure. 7. The carrier head of claim 6 wherein the support structure has a passageway connecting the first portion of the chamber to the second portion of the chamber. 8. The carrier-head of claim 2 wherein the flexure has an outer circumferential portion attached to the base and an inner circumferential portion attached to the support structure. 9. The carrier head of claim 2 wherein the support structure includes an annular ring. 10. The carrier head of claim 2 wherein the support structure includes a circular plate. 11. The carrier head of claim 10 wherein the chamber includes a first portion located above the circular plate and a second portion located below the circular plate. 12. The carrier head of claim 11 wherein the circular plate includes an aperture connecting the first portion of the chamber located above the circular plate to the second portion of the chamber located below the circular plate. 13. The carrier head of claim 12 wherein the circular plate includes a plurality of apertures. 14. The carrier head of claim 13 wherein the membrane is configured to be pulled into the apertures when the chamber is evacuated. 15. The ca rrier head of claim 2 wherein the membrane is configured to be urged away from the support structure if the chamber is pressurized. 16. The carrier head of claim 2 further including a retaining ring connected to the base and surrounding the flexible membrane. 17. The carrier head of claim 2 wherein an outer edge of the support structure includes a downwardly-projecting lip, and the flexible membrane extends around the lip. 18. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a support structure; an annular flexure connecting the base to the support structure; a flexible membrane having a mounting surface for a substrate, an edge of the membrane extending around a corner of the support structure, the membrane connected to and extending beneath the support structure to define, in conjunction with an inner surface of the base, an inner surface of the support structure and an inner surface of the flexure, a chamber; and the support structure, flexure and membrane configured such that a downward pressure on the flexure is substantially balanced by an upward pressure on the support structure so that a downward pressure at the edge of the membrane is substantially the same as a downward pressure at other portions of the membrane. 19. The carrier head of claim 18 wherein the flexure extends over the support structure. 20. The carrier head of claim 19 wherein the flexure includes an outer circumferential portion attached to the base and an inner circumferential portion attached to the support structure. 21. The carrier head of claim 19 wherein a surface area of a lower surface the support, structure is approximately equal to a surface area of an upper surface of the flexure. 22. The carrier head of claim 18 further comprising a clamp, and wherein the flexible membrane extends above a portion of the support structure to be secured between the support structure and the clamp. 23. The carrier head of claim 22 wherein an outer diameter of the clamp is less than an outer diameter of the support structure, so that a portion of the flexible membrane includes an exposed upper surface. 24. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a support structure; a flexure attached to the base and the support structure, such that a gap is formed between the flexure and the support structure; a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a chamber; and a passage connected to the gap for introducing a fluid into the gap to force a slurry out of the gap. 25. The carrier head of claim 24 wherein the passage includes a channel through the support structure connecting the chamber to the gap. 26. The carrier head of claim 25 wherein the passage further includes a channel through the base. 27. The carrier head of claim 26 wherein the passage further includes a fitting positioned in the chamber connecting the channel through the support structure to the channel through the base. 28. The carrier head of claim 24 further comprising a channel through a housing and a flexibl e fluid connector connecting the channel through the housing to the passage. 29. A carrier head for positioning a substrate on a polishing surface, comprising:a housing connectable to a drive shaft to rotate therewith; a base; a gimbal mechanism pivotally connecting the housing to the base to permit the base to rotate with respect to the housing; and a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the base to define a chamber. 30. The carrier head of claim 29 wherein the gimbal mechanism includes a vertical passage connecting a top surface of the housing to the chamber. 31. The carrier head of claim 29 further comprising a support structure connected to the base by a flexure, and wherein the membrane is attached to the support structure. 32. The carrier head of claim 31 wherein the flexure has an outer circumferential portion attached to the base and an inner circumferential portion attached to the support structure. 33. The carrier head of claim 29 further including a loading mechanism positioned between the housing and the base to apply a downward pressure to the base. 34. The carrier head of claim 29 wherein the housing includes a substantially vertical passage and the gimbal mechanism includes a rod having an upper end slidably disposed in the passage. 35. The carrier head of claim 34 wherein the gimbal mechanism includes a bearing base with a spherical outer surface connected to a lower end of the rod, and the gimbal mechanism further includes a gimbal race with a spherical inner surface connected to the base, the outer surface of the bearing base engaging the inner surface of the gimbal race. 36. The carrier head of claim 34 wherein the gimbal mechanism includes a slightly flexible ring connecting a lower end of the rod to the base. 37. A carrier head for positioning a substrate on a polishing surface, comprising:a housing connectable to a drive shaft to rotate therewith; a base; a loading mechanism connecting the housing to the base to apply a downward pressure to the base; and a gimbal mechanism connecting the housing to the base to permit the base to pivot with respect to the housing about an axis substantially parallel to the polishing surface, the gimbal mechanism includinga rod having an upper end slidably disposed in a vertical passage in the housing, and a flexible member connecting a lower end of the rod to the base. 38. The carrier head of claim 37 wherein the member comprises an annular ring with an inner circumferential portion connected to the rod and an outer circumferential portion connected to the base. 39. The carrier head of claim 37 wherein the member is bendable vertically but is rigid radially. 40. The carrier head of claim 37 further comprising a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the base to define a chamber. 41. The carrier head of claim 37 further comprising a support structure, a flexure connecting the base to the support structure, and a flexible membrane connected to and extending beneath the support structure to define a chambe r. 42. The carrier head of claim 37 wherein a stop is formed at the upper end of the rod to engage a surface to prevent downward motion of the base. 43. A carrier head for a chemical mechanical polishing apparatus, comprising:a housing connectable to a drive shaft to rotate therewith; a loading mechanism connecting the housing to a base to permit vertical movement of the base relative to the housing; and a cushion attached to a lower surface of the housing to limit upward travel of the base. 44. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a first flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the base to define a first chamber; and a second flexible membrane connected to the base and positioned above the first membrane to define a second chamber, the second membrane positioned to exert a downward pressure on the first membrane when fluid is forced into the second chamber. 45. The carrier head of claim 44 further comprising a support structure connected to the base by a flexure, wherein the first membrane is attached to and extends beneath the support structure to define the first chamber. 46. The carrier head of claim 45 wherein the second membrane is positioned to contact the support structure. 47. The carrier head of claim 44 wherein the second membrane is positioned to directly contact the first membrane. 48. The carrier head of claim 47 further comprising a support structure connected to the base by a flexure, wherein the first membrane is attached to and extends beneath the support structure to define the first chamber. 49. The carrier head of claim 48 wherein the support structure includes a support ring, and the second membrane is positioned to extend through the center of the support ring to contact the first membrane. 50. The carrier head of claim 44 used in a chemical mechanical polishing apparatus including a first fluid supply connected to the first chamber, a second fluid supply connected to the second chamber, and a sensor for measuring a pressure in the second chamber. 51. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a support structure connected to the base by a flexure; a first membrane portion connected to and extending beneath the base to define a first substantially circular chamber; and a second membrane portion connected to and extending beneath the support structure to define a second substantially annular chamber which surrounds the first chamber. 52. The carrier head of claim 51 wherein a lower surface of the first membrane portion contacts an upper surface of the second membrane portion. 53. The carrier head of claim 52 wherein the lower surface of the first membrane portion is adhesively attached to the upper surface of the second membrane portion. 54. A carrier head for a chemical mechanical polishing apparatus, comprising:a base; a support structure including a support plate having a recessed region therein, the support structure connected to the base by a flexure; a first membrane having a mounting surface for a substrate, the membran e connected to and extending beneath the support structure to define a chamber, wherein the membrane is configured to be drawn into the recessed region if fluid is forced out of the chamber. 55. The carrier head of claim 54 wherein the chamber includes a first volume between the base and the support plate and a second volume between the support plate and the flexible membrane. 56. The carrier head of claim 54 wherein the support plate includes a passage connecting the first volume to the second volume. 57. A carrier head for a chemical mechanical polishing apparatus, comprising:a support structure; a flexible membrane having a mounting surface for a substrate, the membrane connected to and extending beneath the support structure to define a chamber; a port for applying a vacuum to the chamber; and a recessed region in a bottom face of the support structure, the membrane arranged and configured to be drawn into the recessed region if the chamber is evacuated to produce a reduced pressure area between the flexible membrane and an upper surface of a substrate, the recessed region distributed in an asymmetrical fashion. 58. A method of sensing the presence of a substrate in a carrier head, comprising the steps of:pressurizing a first chamber formed by a first flexible membrane having a mounting surface for the substrate; pressurizing a second chamber formed by a second flexible membrane to a first pressure, the second membrane positioned to contact the first membrane above the mounting surface; sealing the second volume; placing a substrate against the mounting surface; forcing fluid out of the first chamber to create a reduced pressure region to chuck the substrate to the mounting surface; measuring a second pressure in the second chamber. 59. The method of claim 58 further comprising indicating that the substrate is present in the carrier head if the second pressure is greater than the first pressure. 60. The method of claim 58 further comprising indicating that the substrate is not present in the carrier head if the second pressure is equal to the first pressure. 61. A method of chucking a substrate to a mounting surface of a carrier head, comprising the steps of:positioning a substrate against a mounting surface of a carrier head; forcing fluid into a first chamber defined by a first flexible membrane to apply a downward pressure to an annular area of substrate; forcing fluid out of a second chamber defined by a second membrane to draw the second membrane upwardly and create a reduced pressure region bounded by the annular area to chuck the substrate to the mounting surface. 62. The method of claim 61, wherein the first membrane applies a downward force to an annular area of the second membrane. 63. The method of claim 62 wherein first membrane directly contacts the first membrane. 64. The method of claim 62 wherein the first membrane contacts a support structure and the second membrane is connected to the support structure. 65. The method of claim 61 wherein the first flexible membrane directly contacts the substrate. 66. The method of claim 65 wherein the first chamber is substantially annular.
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